Method of metal plating of polymer-containing substrates

Abstract

Method of forming a metallic plating (9) on a substrate (1), comprising the steps of: —providing a substrate (1) comprising a hydrocarbon-based polymer containing C—C and either or both of C—H and N—H bonds; —covalently bonding an azide-containing primer compound (3) to said substrate (1) by C—H and/or N—H insertion, said primer compound (3) comprising molecules each having at plurality of C—H and/or C—N insertion sites; —in the absence of in-situ polymerisation, covalently bonding a pre-synthesised chelating polymer (5) to said primer compound (3) by C—H and/or N—H insertion, said chelating polymer (5) being capable of forming ligand bonds with metal atoms or ions; —dispersing a plating catalyst (7) in said pre-synthesised polymer (5); —forming said metallic plating (9) on said pre-synthesised polymer (5) by means of electroless plating or electroplating

1 .- 15 . (canceled) 
     
     
         16 . A method of forming a metallic plating on a substrate, comprising the steps of:
 providing a substrate comprising a hydrocarbon-based polymer containing C—C and either or both of C—H and N—H bonds;   covalently bonding an azide-containing primer compound to said substrate by C—H and/or N—H insertion, said primer compound comprising molecules each having at plurality of C—H and/or C—N insertion sites;   in the absence of in-situ polymerisation, covalently bonding a pre-synthesised chelating polymer to said primer compound by C—H and/or N—H insertion, said chelating polymer being capable of forming ligand bonds with metal atoms or ions;   dispersing a plating catalyst in said pre-synthesised polymer;   forming said metallic plating on said pre-synthesised polymer by means of electroless plating or electroplating.   
     
     
         17 . The method according to  claim 16 , wherein said azide-containing primer compound contains at least two, preferably at least ten, further preferably at least forty azide groups situated on side chains of a core polymeric chain. 
     
     
         18 . The method according to  claim 16 , wherein said catalyst comprises metal ions and/or metal nanoparticles. 
     
     
         19 . The method according to  claim 16 , wherein said catalyst is formed from metal ions which are subsequently reduced to metal by a reducing agent. 
     
     
         20 . The method according to  claim 18 , wherein said ions are palladium ions, platinum ions, nickel ions, silver ions or copper ions. 
     
     
         21 . The method according to  claim 19 , wherein said ions are palladium ions, platinum ions, nickel ions, silver ions or copper ions. 
     
     
         22 . The method according to  claim 16 , wherein said primer compound and said pre-synthesised polymer are applied to said substrate simultaneously. 
     
     
         23 . The method according to  claim 16 , wherein said pre-synthesised polymer is deposited on said substrate and is subjected to UV radiation or heat so as to cause the pre-synthesised polymer to bond covalently to said primer compound. 
     
     
         24 . The method according to  claim 16 , wherein said metallic plating is applied by means of electroless plating or electroplating. 
     
     
         25 . The method according to  claim 24 , wherein said electroless plating or electroplating is carried out in a pH range of 1-3 or 12-14. 
     
     
         26 . The method according to  claim 16 , wherein said polymer has a molecular weight of at least 100,000 Daltons. 
     
     
         27 . The method according to  claim 26 , wherein said polymer has a molecular weight of at least 500,000 Daltons. 
     
     
         28 . The method according to  claim 27 , wherein said polymer has a molecular weight of at least 750,000 Daltons. 
     
     
         29 . The method according to  claim 28 , wherein said polymer has a molecular weight of at least 1,000,000 Daltons. 
     
     
         30 . The method according to  claim 16 , wherein said method does not include any in-situ polymerisation step. 
     
     
         31 . The method according to  claim 16 , wherein said primer does not contain one or more of the following:
 a triazine ring;   an alkylsilane group;   a silanol group;   a maleimide group;   a complex compound based on aluminium or titanium;   dextran.   
     
     
         32 . The method according to  claim 16 , wherein said primer does not contain any of the following:
 a triazine ring;   an alkylsilane group;   a silanol group;   a maleimide group;   a complex compound based on aluminium or titanium;   dextran.   
     
     
         33 . A product comprising:
 a substrate comprising a hydrocarbon-based polymer containing C—C and C—H or N—H bonds;   a metallic plating provided on a surface of said substrate;   
       wherein said metallic plating is formed on said substrate by the method of  claim 16 . 
     
     
         34 . A product according to  claim 33 , wherein said metallic plating is a composite between its constituent metal and said polymer in at least a part of its thickness. 
     
     
         35 . A product according to  claim 33 , wherein said metallic plating comprises at least one of copper, nickel, silver, nickel phosphorous, nickel boron, cupronickel, platinum or palladium. 
     
     
         36 . A product according to  claim 33 , wherein said metallic plating forms an antenna.