Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device

Abstract

The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

1 . A semiconductor device comprising:
 a semiconductor chip including a device portion and a support portion that supports the device portion;   a first protective member that covers a side surface of the semiconductor chip and a first surface of the semiconductor chip perpendicular to the side surface;   a second protective member that covers a second surface of the semiconductor chip opposite to the first surface; and   a wiring formed through the second protective member and the support portion and electrically connected to the device portion.   
     
     
         2 . The semiconductor device according to  claim 1 , further comprising:
 an adhesive between the second protective member and the second surface of the semiconductor chip and that adheres the semiconductor chip to the second protective member.   
     
     
         3 . The semiconductor device according to  claim 2 , wherein the wiring is formed through the adhesive. 
     
     
         4 . The semiconductor device according to  claim 1 , further comprising:
 a solder ball on the wiring.   
     
     
         5 . The semiconductor device according to  claim 4 , wherein a gap is provided between the first surface and the side surface, and the first protective member. 
     
     
         6 . The semiconductor device according to  claim 1 , wherein the first protective member includes glass. 
     
     
         7 . The semiconductor device according to  claim 1 , wherein the device portion includes a photodiode. 
     
     
         8 . An electronic device comprising:
 a semiconductor device; and   a signal processing unit configured to process a signal of the semiconductor device, wherein the semiconductor device includes:
 a semiconductor chip including a device portion and a support portion that supports the device portion; 
 a first protective member that covers a side surface of the semiconductor chip and a first surface of the semiconductor chip perpendicular to the side surface. 
 a second protective member that covers a second surface of the semiconductor chip opposite to the first surface; and 
 a wiring formed through the second protective member and the support portion and electrically connected to the device portion. 
   
     
     
         9 . The electronic device according to  claim 8 , further comprising:
 an adhesive between the second protective member and the second surface of the semiconductor chip and that adheres the semiconductor chip to the second protective member.   
     
     
         10 . The electronic device according to  claim 9 , wherein the wiring is formed through the adhesive. 
     
     
         11 . The electronic device according to  claim 8 , further comprising:
 a solder ball on the wiring.   
     
     
         12 . The electronic device according to  claim 11 , wherein a gap is provided between the first surface and the side surface, and the first protective member. 
     
     
         13 . The electronic device according to  claim 8 , wherein the first protective member includes glass. 
     
     
         14 . The electronic device according to  claim 8 , wherein the device portion includes a photodiode.