Wick structure and system and method of making wick structure
Abstract
In a method of forming a porous wick structure, a space is filled with particles formed from electrically conductive material such that the particles contact one another at contact points within the space. The particles are compressed within the space at a pressure of less than 0.1 MPa. While compressing the particles, electrical current is imparted through the particles in to simultaneously form bonds between adjacent particles at points of contact between the particles. The bonds fix the particles in position with respect to one another such that pores are defined between adjacent particles. A porous wick structure can be formed by this method.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a wick structure, the method comprising:
filling a space with particles formed from electrically conductive material such that the particles contact one another at contact points within the space; compressing the particles within the space at a pressure of less than 0 . 1 MPa while compressing the particles, imparting electrical current through the particles in to simultaneously form bonds between adjacent particles at points of contact between the particles, wherein the bonds fix the particles in position with respect to one another such that pores are defined between adjacent particles.
2 . The method as set forth in any of claim 1 , wherein the step of passing an electrical current through the particles is performed in an inert fluid environment.
3 . A wick structure formed by performing the method of claim 2 .
4 . The wick structure as set forth in claim 3 , wherein the wick structure has a porosity of greater than 0.4.
5 . A wick structure formed by performing the method of claim 1 .
6 . The wick structure as set forth in claim 5 , wherein the wick structure has a porosity of greater than 0.4.Join the waitlist — get patent alerts
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