Heat spreaders for semiconductor devices, and associated systems and methods

Abstract

A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.

I/We claim: 
     
         1 . An electronic system comprising:
 a first circuit module including a first semiconductor device;   a second circuit module including a second semiconductor device;   a first heat spreader configured to be attached to the first semiconductor device and including a plurality of first projections projecting away from the first memory module; and   a second heat spreader configured to be attached to the second semiconductor device and including a plurality of second projections projecting away from the second memory module, wherein the second projections are offset to be positioned between the first projections when the first and second memory modules are arranged with the first and second semiconductor devices facing and mirroring each other,   wherein   at least one projection in the plurality of first and/or second projections has a non-rectangular projection shape or a projection shape having an air channel therein.   
     
     
         2 . The electronic system of  claim 1  wherein the at least one projection has one or more rounded edges in the non-rectangular projection shape. 
     
     
         3 . The electronic system of  claim 2  wherein the one or more rounded edges have a concave shape. 
     
     
         4 . The electronic system of  claim 1  wherein the non-rectangular projection shape is a triangular shape. 
     
     
         5 . The electronic system of  claim 1  wherein the projection includes a set of thermally coupled or structurally integral walls that define the air channel. 
     
     
         6 . The electronic system of  claim 5  wherein two or more projections in the plurality of first and/or second projections have the air channel therein, wherein air channels are oriented along parallel directions. 
     
     
         7 . The electronic system of  claim 6  wherein:
 when the first memory module is attached to the first connector and the second memory module is attached to the second connector, the plurality of first and/or second projections form a plurality of air channels between the first and second memory modules; 
 the air channels are configured to receive a forced air flow from a fan disposed at an end of the memory system; and 
 the projection shape is a front shape. 
 
     
     
         8 . A memory module, comprising:
 a substrate;   a semiconductor device attached to the substrate;   a heat spreader attached to the semiconductor device, the heat spreader including at least one projection having a non-rectangular projection shape or a projection shape having an air channel therein.   
     
     
         9 . The memory module of  claim 8  wherein:
 the semiconductor device is a first semiconductor device; 
 the first semiconductor device is attached to a first side of the substrate; 
 the heat spreader is a first heat spreader and the at least one projection is at least one first projection; 
 further comprising: 
 a second semiconductor device attached to a second side of the substrate, wherein the second side is opposite the first side; and 
 a second heat spreader attached to the second semiconductor device, the second heat spreader including at least one second projection extending toward a direction different than that of the at least one first projection. 
 
     
     
         10 . The memory module of  claim 9  wherein the at least one first projection and the at least one second projection are non-reflective about the substrate. 
     
     
         11 . The memory module of  claim 9  wherein the at least one first projection and the at least one second projection are non-reflective about the substrate. 
     
     
         12 . The memory module of  claim 8  wherein the at least one projection has one or more rounded edges in the non-rectangular projection shape. 
     
     
         13 . The memory module of  claim 12  wherein the one or more rounded edges have a concave shape. 
     
     
         14 . The memory module of  claim 8 , wherein the non-rectangular projection shape is a triangular shape. 
     
     
         15 . The memory module of  claim 8  wherein the projection includes a set of thermally coupled or structurally integral walls that define the air channel. 
     
     
         16 . The memory module of  claim 15  wherein two or more projections in the plurality of first and/or second projections have the air channel therein, wherein air channels are oriented along parallel directions. 
     
     
         17 . The memory module of  claim 15  wherein the projection extends away from the substrate, and the air channel is location at a distal portion of the projection. 
     
     
         18 . A method of manufacturing a memory module, the method comprising:
 attaching a first semiconductor device and a second semiconductor device on opposing sides of a substrate;   disposing a first heat spreader on the first semiconductor device, the first heat spreader having a first set of projections extending away from the substrate;   disposing a second heat spreader on the second semiconductor device, the second heat spreader having a second set of projections extending away from the substrate,   wherein   the first set of projections and the second set of projections are offset about the substrate; and   at least one projection in the first and second sets of projections has a non-rectangular projection shape or a projection shape having an air channel therein.   
     
     
         19 . The method of  claim 18  wherein the non-rectangular projection shape includes one or more rounded edges or a set of angled edges that intersect each other at an angle. 
     
     
         20 . The method of  claim 18  wherein the at least one projection extends away from the substrate and includes an opening located at a distal portion of the at least one projection, wherein the opening comprises the air channel.