System and method for encoding ic chips for payment objects

Abstract

A system for encoding IC chip modules for inclusion in payment objects is provided. The system includes a flexible substrate supportably interconnected to a plurality of IC chip modules an one or more interfaces for encoding data on the plurality of IC chip modules, wherein the data encoded by the one or more interfaces includes data associated with an issuer payment institution. A positioner is configured to engage with the flexible substrate to position the plurality of IC chip modules relative to the one or more interfaces. At least one controller is configured to provide position control signals to the positioner for positioning the IC chip modules relative to the one or more interfaces and to provide encoding control signals to the one or more interfaces to encode the data on the plurality of IC chip modules.

What is claimed is: 
     
         1 . A system for providing integrated circuit (IC) chip modules for use in payment objects, comprising:
 a flexible substrate supportably interconnected to a plurality of IC chip modules;   one or more interfaces for encoding data on the plurality of IC chip modules, wherein the data encoded by the one or more interfaces includes data associated with an issuer payment institution;   a positioner configured to engage with the flexible substrate to position the plurality of IC chip modules relative to the one or more interfaces; and   at least one controller configured to provide position control signals to the positioner for positioning the IC chip modules relative to the one or more interfaces, the at least one controller further configured to provide encoding control signals to the one or more interfaces to encode the data on the plurality of IC chip modules.   
     
     
         2 . The system of  claim 1 , wherein the plurality of IC chip modules are free from fixed interconnection to other structures while supportably interconnected to the flexible substrate. 
     
     
         3 . The system of  claim 1 , wherein the data is encoded in predetermined memory portions of the plurality of IC modules and includes personalization data provided by the issuer payment institution corresponding with a specific payment account administered by the issuer payment institution. 
     
     
         4 . The system of  claim 1 , wherein the controller is further configured to provide control signals to the one or more interfaces causing power termination to the plurality of IC chip modules after encoding, wherein the power termination causes the plurality of IC chip modules to be locked for read or write operations other than by unlocking using issuer key data. 
     
     
         5 . The system of  claim 1 , wherein the controller includes memory storing the data for encoding on the plurality of IC chip modules. 
     
     
         6 . The system of  claim 1 , wherein the one or more interfaces are contactless interfaces comprising a radio frequency signal transceiver for non-contact interface with antennas of the plurality of IC chip modules for data transmission. 
     
     
         7 . The system of  claim 6 , further comprising:
 signal shielding members adjacent to the one or more interfaces, the signal shielding members limiting interference between the one or more interfaces.   
     
     
         8 . The system of  claim 1 , wherein the plurality of IC chip modules are dual interface type chip modules and include an IC chip, an antenna and contact pads interconnected thereto. 
     
     
         9 . The system of  claim 1 , wherein the one or more interfaces include at least a first non-contact interface and a second non-contact interface, the first non-contact interface and the second non-contact interface are configured to encode data on at least a portion of the plurality of IC chip modules. 
     
     
         10 . A method comprising:
 receiving data for encoding on a plurality of integrated circuit (IC) chip modules for use in payment objects, the data including at least data associated with an issuer payment institution;   positioning the plurality of IC chip modules relative to one or more encoding interfaces by engaging a flexible substrate supportably connected to the plurality of IC chip modules; and   encoding the data on the plurality of IC chip modules while the plurality of IC chip modules are supportably connected to the flexible substrate.   
     
     
         11 . The method of  claim 10 , wherein the data is encoded in predetermined memory portions of the plurality of IC chip modules and includes personalization data provided by the issuer payment institution corresponding with a specific payment account administered by the issuer payment institution. 
     
     
         12 . The method of  claim 10 , further comprising:
 terminating power to the plurality of IC chip modules after encoding, wherein the power termination causes the plurality of IC chip modules to be locked for read or write operations other than by unlocking using issuer key data.   
     
     
         13 . The method of  claim 10 , wherein encoding the data on the plurality of IC chip modules comprises encoding, on a first portion of the plurality of IC chip modules, the data by a first encoding interface and encoding, on a second portion of the plurality of IC chip modules, the data by a second encoding interface. 
     
     
         14 . The method of  claim 13 , wherein the first encoding interface and the second encoding interface are contactless interfaces comprising a radio frequency signal transceiver for non-contact interface with antennas of the plurality of IC chip modules for data transmission. 
     
     
         15 . The method of  claim 14 , wherein the first encoding interface and the second encoding interface are separated by a shielding member limiting interference between the first encoding interface and the second encoding interface. 
     
     
         16 . One or more non-transitory computer readable media encoded with instructions which, when executed by one or more processors of a controller, cause the controller to:
 receive data for encoding on a plurality of integrated circuit (IC) chip modules for use in payment objects, the data including at least data associated with an issuer payment institution;   provide position control signals to a positioner, wherein the positioner engages a flexible substrate supportably connected to the plurality of IC chip modules to position the plurality of IC chip modules relative to one or more encoding interfaces; and   provide encoding control signals to the one or more encoding interfaces to cause the encoding interfaces to encode the data on the plurality of IC chip modules while the plurality of IC chip modules are supportably connected to the flexible substrate.   
     
     
         17 . The non-transitory computer readable media of  claim 16 , wherein the data includes personalization data provided by the issuer payment institution corresponding with a specific payment account administered by the issuer payment institution. 
     
     
         18 . The non-transitory computer readable media of  claim 16 , wherein the instructions further cause the controller to:
 terminate power to the plurality of IC chip modules after encoding, wherein the power termination causes the plurality of IC chip modules to be locked for read or write operations other than by unlocking using issuer key data.   
     
     
         19 . The non-transitory computer readable media of  claim 16 , wherein providing encoding control signals comprises providing encoding signals for encoding the data on a first portion of the plurality of IC chip modules to a first encoding interface and providing encoding signals for encoding the data on a second portion of the plurality of IC chip modules to a second encoding interface. 
     
     
         20 . The non-transitory computer readable media of  claim 19 , wherein the first encoding interface and the second encoding interface are contactless interfaces comprising a radio frequency signal transceiver for non-contact interface with antennas of the plurality of IC chip modules for data transmission. 
     
     
         21 . The non-transitory computer readable media of  claim 20 , wherein the first encoding interface and the second encoding interface are separated by a shielding member limiting interference between the first encoding interface and the second encoding interface.