Photocurable composition for imprint, method for producing film using the same, method for producing optical component using the same, method for producing circuit board using the same, and method for producing electronic component using the same

Abstract

A photocurable composition for imprint at least has a polymerizable compound (A) and a photopolymerization initiator (B), in which the polymerizable compound (A) contains 20% by weight or more of a multifunctional (meth)acrylic monomer and the glass transition temperature of a photocured substance of the photocurable composition is 90° C. or more.

1 . A photocurable composition for a cured film which is obtained by curing the photocurable composition applied on a substrate and used when etching the substrate, the photocurable composition at least comprising:
 a polymerizable compound (A); and   a photopolymerization initiator (B),   wherein the polymerizable compound (A) contains 25% by weight or more of a multifunctional (meth)acrylic monomer,   wherein a glass transition temperature of a photocured substance of the photocurable composition is 101° C. or more,   wherein the polymerizable compound (A) is a mixture of a monofunctional (meth)acrylic monomer and a multifunctional (meth)acrylic monomer,   wherein an Ohnishi parameter of the polymerizable compound (A) is 3.2 or less.   
     
     
         2 . The photocurable composition according to  claim 1 , wherein the polymerizable compound (A) contains 40% by weight or more of the multifunctional (meth)acrylic monomer. 
     
     
         3 . The photocurable composition according to  claim 1 , wherein a glass transition temperature of a photocured substance of the photocurable composition is 131° C. or more. 
     
     
         4 . The photocurable composition according to  claim 1 , wherein a viscosity of the photocurable composition is 5 mPa*s or more and 50 mPa*s or less. 
     
     
         5 . The photocurable composition according to  claim 1 , wherein a viscosity of the photocurable composition is 3 mPa*s or more and 10.6 mPa*s or less. 
     
     
         6 . The photocurable composition according to  claim 1 , wherein the photocurable composition having a glass transition temperature of 101° C. or more is specified by measuring a loss tangent tan δ of a film obtained by photocuring a photocurable composition containing 100 parts by weight of the polymerizable compound (A) and 3 parts by weight of Lucirin TPO as the photopolymerization initiator (B) while increasing a temperature to find out that a temperature at which the tan δ reaches a maximum is 101° C. or more. 
     
     
         7 . The photocurable composition according to  claim 1 , wherein a multifunctional acrylic monomer contained in the polymerizable compound (A) is any one of m-xylylene diacrylate, phenyl ethylene glycol diacrylate, and 2-phenyl-1,3-propanediol diacrylate. 
     
     
         8 . A method for producing a film comprising:
 a step (1) of arranging the photocurable composition according to  claim 1  on a substrate;   a step (2) of bringing the curable composition into contact with a mold;   a step (3) of aligning the substrate and the mold;   a step (4) of irradiating the curable composition with light to form a photocured film; and   a step (5) of releasing the cured film and the mold from each other.   
     
     
         9 . The method for producing a film according to  claim 8 , comprising performing the steps (1) to (5) two or more times to different regions on the substrate. 
     
     
         10 . The method for producing a film according to  claim 8 , wherein a surface of the mold contains quartz. 
     
     
         11 . The method for producing a film according to  claim 8 , wherein the step (2) is performed under an atmosphere containing condensable gas. 
     
     
         12 . A method for producing an optical component, comprising the step of obtaining a film by the manufacturing method according to  claim 8 . 
     
     
         13 . A method for producing an optical component, comprising:
 a step of obtaining a film by the manufacturing method according to  claim 8 ; and   a step of performing etching or ion implantation to a substrate.   
     
     
         14 . A method for producing a circuit board, comprising:
 a step of obtaining a film by the manufacturing method according to  claim 8 ; and   a step of performing etching or ion implantation to a substrate using the obtained film.   
     
     
         15 . A method for producing an electronic component, comprising:
 a step of obtaining a circuit board by the method for producing a circuit board according to  claim 14 .   
     
     
         16 . The method for producing an electronic component according to  claim 15 , wherein the electronic component is a semiconductor device. 
     
     
         17 . A photocured film for dry etching, which is used for dry etching, the photocured film being obtained by curing the photocurable composition according to  claim 1  on the substrate. 
     
     
         18 . A semiconductor substrate pretreated by dry etching, comprising:
 a semiconductor substrate; and   the photocured film for etching according to  claim 17  patterned onto the semiconductor substrate.