Plating solution and metal composite and method of manufacturing the same

Abstract

A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

What is claimed is: 
     
         1 . A metal composite material comprising
 a metal and a hydrophilic fullerene, the hydrophilic fullerene being chemically bonded with the metal to a metal-fullerene composite, and   a particle diameter of the metal-fullerene composite measured through dynamic light scattering being less than or equal to about 10 nanometers.   
     
     
         2 . The metal composite material of  claim 1 , wherein the metal comprises copper, silver, gold, aluminum, calcium, zinc, tungsten, iron, tin, platinum, nickel, or a combination thereof. 
     
     
         3 . The metal composite material of  claim 1 , wherein the hydrophilic fullerene comprises a hydrophilic functional group bound to a fullerene core. 
     
     
         4 . The metal composite material of  claim 3 , wherein the hydrophilic functional group comprises a hydroxyl group, an amino group, a carbonyl group, a carboxyl group, a sulfhydryl group, a phosphate group, or a combination thereof. 
     
     
         5 . The metal composite material of  claim 3 , wherein the hydrophilic fullerene comprises an average of about 2 to about 44 functional groups bound to the fullerene core. 
     
     
         6 . The metal composite material of  claim 3 , wherein the hydrophilic fullerene comprises an average of 12 to 44 functional groups bound to the fullerene core. 
     
     
         7 . The metal composite material of  claim 1 , wherein the hydrophilic fullerene is represented by C x (OH) y  (wherein, x is 60, 70, 74, 76, or 78, and an average value of y is about 2 to about 44). 
     
     
         8 . A wire comprising the metal composite material of  claim 1 . 
     
     
         9 . The wire of  claim 8 , wherein the wire has a pitch of less than or equal to about 20 nm. 
     
     
         10 . A flexible printed circuit comprising the wire of  claim 8 . 
     
     
         11 . An electronic device comprising the wire of  claim 8 . 
     
     
         12 . An electronic device comprising the flexible printed circuit of  claim 10 .