US2021217626A1PendingUtilityA1

Etching method and plating solution

61
Assignee: TOSHIBA KKPriority: Sep 26, 2018Filed: Mar 29, 2021Published: Jul 15, 2021
Est. expirySep 26, 2038(~12.2 yrs left)· nominal 20-yr term from priority
Inventors:Mitsuo SanoKeiichiro MatsuoSusumu ObataKazuhito HiguchiKazuo Shimokawa
H10P 76/4085H10P 76/4083H10P 76/405H10P 50/694H10P 50/642H10P 54/00C23C 18/1605C23C 18/54H01L 21/30604H01L 21/0335H01L 21/3085
61
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

According to an embodiment, a method of forming a porous layer includes forming a porous layer containing a noble metal on a surface made of a semiconductor by displacement plating. The plating solution used in the displacement plating contains a noble metal source, hydrogen fluoride, and an adjusting agent adjusting a pH value or zeta potential. The noble metal source produces an ion containing the noble metal in water. The plating solution has a pH value in a range of 1 to 6.

Claims

exact text as granted — not AI-modified
1 - 15 . (canceled) 
     
     
         16 : A plating solution comprising:
 a noble metal source producing an ion containing the noble metal in an aqueous solution; and   an adjusting agent adjusting a pH value or zeta potential,   wherein the plating solution has a pH value in a range of 1 to 6.   
     
     
         17 : The plating solution according to  claim 16 , further comprising hydrogen fluoride. 
     
     
         18 : The plating solution according to  claim 16 , wherein the noble metal includes gold. 
     
     
         19 : The plating solution according to  claim 16 , wherein the adjusting agent comprises at least one of a nonionic surfactant and an anionic surfactant. 
     
     
         20 : The plating solution according to  claim 16 , wherein the adjusting agent includes a polymeric additive. 
     
     
         21 : The plating solution according to  claim 20 , wherein the plating solution comprises polyethylene glycol having an average molecular weight in a range of 1,000 to 100,000 as the polymeric additive. 
     
     
         22 : The plating solution according to  claim 20 , wherein the plating solution comprises polyethylene glycol as the polymeric additive at a concentration of 0.0005 to 5% by mass. 
     
     
         23 : The plating solution according to  claim 16 , wherein the adjusting agent further comprises one or more selected from the group consisting of ammonium fluoride, ammonia, sodium hydroxide, and potassium hydroxide. 
     
     
         24 : The plating solution according to  claim 16 , wherein the plating solution has the pH value in a range of 4 to 6.

Join the waitlist — get patent alerts

Track US2021217626A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.