Chamber design for semiconductor processing

Abstract

Embodiments described herein provide an apparatus for improving deposition uniformity by improving plasma profile using a tri-cut chamber liner. The apparatus also includes a lid assembly having a split process stack for reducing downtime and a bottom heater support for more efficient heating of chamber walls.

1 . A PECVD process chamber, comprising:
 a chamber body having a slit valve opening; and   a process liner disposed in the chamber body, wherein the process liner has three symmetrical openings and one of the openings is aligned with the slit valve opening.   
     
     
         2 . A PECVD process chamber, comprising:
 a bottom wall and a side wall;   a metal heater plate disposed over the bottom wall; and   a bottom plate disposed between the metal heater plate and the bottom wall, wherein gaps are formed between the metal heater plate and the bottom plate.   
     
     
         3 . The PECVD process chamber of  claim 1 , further comprising one or more split process stacks disposed on the chamber body and a lid assembly disposed above the chamber body, wherein the lid assembly includes a lid cover, and wherein first portions of the one or more split process stacks are supported by the chamber body and second portions of the one or more split process stacks are supported by a lid cover. 
     
     
         4 . The PECVD process chamber of  claim 3 , wherein the one or more split process stacks each includes an isolator, a gas box, a blocker plate, a faceplate, and a faceplate heater. 
     
     
         5 . The PECVD process chamber of  claim 4 , wherein the first portions of the one or more split process stacks include the isolator and the gas box and the second portions of the one or more split process stacks include the blocker plate, the faceplate, and the faceplate heater. 
     
     
         6 . The PECVD process chamber of  claim 2 , further comprising a chamber body including the bottom wall and the side wall, and a process liner disposed in the chamber body, wherein the process liner has three symmetrical openings. 
     
     
         7 . The PECVD process chamber of  claim 6 , wherein one of the three symmetrical openings is aligned with a slit valve opening formed in the side wall. 
     
     
         8 . The PECVD process chamber of  claim 7 , further comprising one or more split process stacks disposed on the chamber body and a lid assembly disposed above the chamber body. 
     
     
         9 . The PECVD process chamber of  claim 8 , wherein the one or more split process stacks each includes an isolator, a gas box, a blocker plate, a faceplate, and a faceplate heater. 
     
     
         10 . The PECVD process chamber of  claim 8 , wherein the lid assembly includes a lid cover, and wherein first portions of the one or more split process stacks are supported by the chamber body and second portions of the one or more split process stacks are supported by a lid cover. 
     
     
         11 . The PECVD process chamber of  claim 10 , wherein the first portions of the one or more split process stacks include the isolator and the gas box and the second portions of the one or more split process stacks include the blocker plate, the faceplate, and the faceplate heater. 
     
     
         12 . The PECVD process chamber of  claim 10 , wherein the lid cover covers both the first and the second portions of the one or more split process stacks. 
     
     
         13 . A PECVD process chamber, comprising:
 a chamber body; and   a lid assembly disposed above the chamber body, the lid assembly comprising:
 one or more split process stacks disposed over the chamber body, wherein the one or more split process stacks each comprises a first portion including a blocker plate, a faceplate, and a faceplate heater, and a second portion including an isolator and a gas box, wherein the first portion is disposed over the chamber body and the second portion is disposed over the first portion; and 
 a lid cover coupled to the second portion of each split process stack. 
   
     
     
         14 . The PECVD process chamber of  claim 13 , wherein the lid cover covers both the first and second portions of the one or more split process stacks. 
     
     
         15 . The PECVD process chamber of  claim 13 , wherein the one or more split process stacks include two split process stacks. 
     
     
         16 . The PECVD process chamber of  claim 13 , further comprising a lift mechanism comprising a first cylinder and a second cylinder on each side of the lid assembly. 
     
     
         17 . The PECVD process chamber of  claim 16 , wherein the first cylinder and the second cylinder are hydraulic. 
     
     
         18 . The PECVD process chamber of  claim 16 , wherein the first cylinder and the second cylinder are pneumatic. 
     
     
         19 . The PECVD process chamber of  claim 13 , further comprising:
 a slit valve opening formed in the chamber body; and   a process liner disposed in the chamber body, wherein the process liner has three symmetrical openings and one of the openings is aligned with the slit valve opening.   
     
     
         20 . The PECVD process chamber of  claim 13 , further comprising:
 a bottom wall and a side wall;   a metal heater plate disposed over the bottom wall; and   a bottom plate disposed between the metal heater plate and the bottom wall, wherein gaps are formed between the metal heater plate and the bottom plate.