Package structure and method of manufacturing the same

Abstract

A package structure and a method of forming the same are provided. The package structure includes a first die and a second die, a first encapsulant, a second encapsulant and a RDL structure. The first die includes a first connector and a first protection layer covering sidewalls of the first connector, and the second die includes a second connector. The first encapsulant is at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other. The second encapsulant encapsulates second sidewalls of the first die and the second die. The RDL structure is disposed on and electrically connected to the first die and the second die. The top surfaces of the first protection layer, the first encapsulant, and the second encapsulant are in contact with a bottom surface of the RDL structure.

What is claimed is: 
     
         1 . A package structure, comprising:
 a first die and a second die, wherein the first die comprises a first connector and a first protection layer covering sidewalls of the first connector, the second die comprises a second connector;   a first encapsulant, at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other; and   a second encapsulant, encapsulating second sidewalls of the first die and the second die; and   a redistribution layer (RDL) structure, disposed on and electrically connected to the first die and the second die, wherein top surfaces of the first protection layer, the first encapsulant and the second encapsulant are in contact with a bottom surface of the RDL structure.   
     
     
         2 . The package structure of  claim 1 , wherein sidewalls of the first protection layer are covered by and in physical contact with the first encapsulant and the second encapsulant. 
     
     
         3 . The package structure of  claim 1 , where the first encapsulant is further disposed to encapsulate sidewalls of the second connector of the second die. 
     
     
         4 . The package structure of  claim 1 , wherein the second die further comprises a second protection layer disposed to cover sidewalls of the second connector, and sidewalls of the second protection layer are covered by the first encapsulant and the second encapsulant. 
     
     
         5 . The package structure of  claim 1 , wherein the first connector of the first die is separated from the first encapsulant and the second encapsulant by the first protection layer. 
     
     
         6 . The package structure of  claim 1 , wherein interfaces are existed between the first protection layer and the first encapsulant, and between the first protection layer and the second encapsulant. 
     
     
         7 . The package structure of  claim 1 , wherein the first encapsulant and the second encapsulant comprise fillers, while the protection layer is free of fillers. 
     
     
         8 . The package structure of  claim 1 , wherein the first encapsulant and the second encapsulant comprise different materials. 
     
     
         9 . The package structure of  claim 1 , wherein the first encapsulant comprises a first filler, the second encapsulant comprises a second filler, and a particle size of the first filler is less than a particle size of the second filler. 
     
     
         10 . A package structure, comprising:
 a first die and a second die, wherein the first die comprises a first connector, and the second die comprises a second connector;   a first encapsulant, laterally between the first die and the second die, and on the second die, wherein the first connector is separated from the first encapsulant by a protection layer of the first die, and the second connector of the second die is in contact with the first encapsulant;   a second encapsulant, laterally encapsulating the first die, the second die and the first encapsulant; and   a conductive terminal, electrically connected to the first die and the second die through a redistribution layer (RDL) structure.   
     
     
         11 . The package structure of  claim 10 , wherein a top surface of the protection layer of the first die is substantially coplanar with a top surface of the first encapsulant. 
     
     
         12 . The package structure of  claim 10 , wherein the RDL structure comprises a redistribution layer electrically connected to the first die and the second die, the redistribution layer comprises:
 a first via, landing on the first connector of the first die;   a second via, landing on the second connector of the second die; and   a trace, extending from the first via to the second via, wherein the trace is overlapped with the protection layer and the first encapsulant in a direction perpendicular to a top surface of the first die.   
     
     
         13 . The package structure of  claim 10 , wherein a portion of the second encapsulant is vertically sandwiched between the first encapsulant and the RDL structure. 
     
     
         14 . The package structure of  claim 10 , wherein a portion of first encapsulant further extends to be sandwiched between a sidewall of the second die and the second encapsulant. 
     
     
         15 . The package structure of  claim 10 , wherein an interface is existed between the first encapsulant and the second encapsulant. 
     
     
         16 . A method of forming a package structure, comprising:
 providing a first die and a second die, wherein the first die comprises a first connector and a first protection layer covering sidewalls of the first connector, and the second die comprises a second connector;   forming a first encapsulant at least between the first die and the second die;   forming a second encapsulant to laterally encapsulate the first die and the second die, wherein the first encapsulant and the second encapsulant are formed by different processes; and   forming a redistribution layer (RDL) structure on and electrically connected to the first die and the second die, wherein top surfaces of the first protection layer, the first encapsulant and the second encapsulant are in contact with a bottom surface of the RDL structure.   
     
     
         17 . The method of  claim 16 , wherein forming the first encapsulant and the second encapsulant comprises:
 forming a first encapsulant material layer to fill a gap between the first die and the second die;   forming a second encapsulant material layer to encapsulate the first die, the second die and the first encapsulant material layer; and   performing a planarization process to remove excess portions of the first encapsulant material layer and the second encapsulant material layer, so as to expose the first connector and the first protection layer of the first die and the second connector of the second die.   
     
     
         18 . The method of  claim 17 , wherein the first encapsulant material layer is formed by a dispensing process, while the second encapsulant material layer is formed by a molding process. 
     
     
         19 . The method of  claim 16 , wherein the first encapsulant is further formed to encapsulate sidewalls of the second connector of the second die. 
     
     
         20 . The method of  claim 16 , wherein the second die further comprises a second protection layer covering sidewalls of the second connector, and the first encapsulant is formed to be laterally sandwiched between the first protection layer and the second protection layer.