Head suspension assembly and disk apparatus

Abstract

A head suspension assembly includes a support plate, an interconnection member including a metal plate on the support plate, a first insulating layer on the metal plate, a conductive layer on the first insulating layer and forming a pair of connection pads, and a second insulating layer on the conductive layer, a head mounted in the interconnection member, and a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied across the connection pads. At least one opening is formed in each of the connection pads. The piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled in the opening.

What is claimed is: 
     
         1 . A head suspension assembly comprising:
 a support plate;   an interconnection member comprising
 a metal plate on the support plate, 
 a first insulating layer on the metal plate, 
 a conductive layer on the first insulating layer and forming a pair of connection pads, and 
 a second insulating layer on the conductive layer; 
   a head mounted on the interconnection member; and   a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads, wherein   a plurality of openings is formed on the connection pads, and   the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the openings.   
     
     
         2 . The head suspension assembly according to  claim 1 , wherein each of the openings penetrates the conductive layer. 
     
     
         3 . The head suspension assembly according to  claim 2 , wherein the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of each of the openings, and a part of the first insulating layer. 
     
     
         4 . The head suspension assembly according to  claim 1 , wherein
 each of the openings penetrates the conductive layer and the first insulating layer, and   the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of each of the openings, and a part of the metal plate.   
     
     
         5 . The head suspension assembly according to  claim 1 , wherein the openings are arranged on both ends of one of the connection pads. 
     
     
         6 . The head suspension assembly according to  claim 5 , wherein no opening is formed on the other of the connection pads. 
     
     
         7 . The head suspension assembly according to  claim 1 , wherein the openings form a comb-teeth shape. 
     
     
         8 . The head suspension assembly according to  claim 1 , wherein each of the openings extends along a longitudinal direction of the piezoelectric element. 
     
     
         9 . A disk apparatus comprising:
 a disk-like recording medium having a recording layer; and   a head suspension assembly comprising:
 a support plate, 
 an interconnection member disposed on the support plate and comprising:
 a metal plate on the support plate, 
 a first insulating layer on the metal plate, 
 a conductive layer on the first insulating layer and forming a pair of connection pads, and 
 a second insulating layer on the conductive layer, 
 
 a head mounted on the interconnection member and configured to read data from and write data onto the recording layer, and 
 a piezoelectric element electrically connected to the connection pads and configured to displace the head when a predetermined voltage is applied to the connection pads,
 wherein 
 
 a plurality of openings is formed on the connection pads, and 
 the piezoelectric element is electrically connected to each of the connection pads by a conductive adhesive that is between the piezoelectric element and each of the connection pads and filled into the openings. 
   
     
     
         10 . The disk apparatus according to  claim 9 , wherein each of the openings penetrates the conductive layer. 
     
     
         11 . The disk apparatus according to  claim 10 , wherein the conductive adhesive is bonded to a surface of each of the connection pads, an inner surface of each of the openings, and a part of the first insulating layer. 
     
     
         12 . The disk apparatus according to  claim 9 , wherein
 each of the openings penetrates the conductive layer and the first insulating layer, and   the conductive adhesive is bonded to the surface of the one of the connection pads, an inner surface of each of the openings, and a part of the metal plate.   
     
     
         13 . The disk apparatus according to  claim 9 , wherein the openings are arranged on both ends of one of the connection pads. 
     
     
         14 . The disk apparatus according to  claim 13 , wherein no opening is formed on the other of the connection pads. 
     
     
         15 . The disk apparatus according to  claim 9 , wherein the openings form a comb-teeth shape. 
     
     
         16 . The disk apparatus according to  claim 9 , wherein each of the openings extends along a longitudinal direction of the piezoelectric element.