US2021207258A1PendingUtilityA1

Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element

Assignee: DAINIPPON PRINTING CO LTDPriority: Mar 26, 2013Filed: Mar 19, 2021Published: Jul 8, 2021
Est. expiryMar 26, 2033(~6.7 yrs left)· nominal 20-yr term from priority
B05C 21/005H10K 71/00C23C 14/042C23C 14/048H01L 51/56H01L 51/0011H10K 71/166H10K 71/231
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Claims

Abstract

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Claims

exact text as granted — not AI-modified
1 . A vapor deposition mask preparation body for obtaining a vapor deposition mask including: a metal mask in which a slit is provided; and a resin mask in which openings corresponding to a pattern to be produced by vapor deposition are provided at a position overlapping the slit, the metal mask and the resin mask being stacked, wherein
 the metal mask in which the slit is provided is stacked on one surface of a resin plate, and   the metal mask has a general region in which the slit is provided and a thick region larger in thickness than the general region.   
     
     
         2 . A method for producing a vapor deposition mask, comprising:
 a step of pasting a metal mask in which a slit is provided and a resin plate together; and   a step of forming openings corresponding to a pattern to be produced by vapor deposition in the resin plate by irradiation with laser from the metal mask side, wherein   as the metal mask, a metal mask having a general region in which the slit is provided and a thick region larger in thickness than the general region is used.   
     
     
         3 . The method for producing a vapor deposition mask according to  claim 2 , wherein
 the metal mask is a metal mask obtained   by a step of forming the general region by masking of a part of the metal plate to be the thick region and slimming processing of a region in the metal plate that does not undergo the masking, and   by forming the slit in the general region.   
     
     
         4 . The method for producing a vapor deposition mask according to  claim 2 , wherein after the metal mask that the resin plate is pasted on is fixed onto a frame, the step of forming the openings corresponding to the pattern to be produced by vapor deposition in the resin plate by irradiation with laser from the metal mask side is performed.

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