Device enclosure

Abstract

An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

What is claimed is: 
     
         1 . A housing of an electronic device, comprising:
 a metal outer portion including a first material having a first set of material properties, the metal outer portion at least partially defining a feature;   an inner portion including a second material having a second set of material properties independent of the first set of material properties, the inner portion at least partially defining the feature; and   an engagement feature configured to mechanically engage a moldable material, the engagement feature positioned at a surface of the housing defined by the inner portion and the metal outer portion.   
     
     
         2 . The housing of  claim 1 , wherein the engagement feature comprises at least one of a nano-structured or micro-structured feature. 
     
     
         3 . The housing of  claim 1 , wherein the engagement feature is formed by an etching or machining process. 
     
     
         4 . The housing of  claim 1 , wherein the engagement feature is formed by an additive manufacturing process. 
     
     
         5 . The housing of  claim 1 , wherein the first material comprises steel. 
     
     
         6 . The housing of  claim 1 , wherein the second material comprises metal. 
     
     
         7 . The housing of  claim 1 , wherein the second material comprises aluminum. 
     
     
         8 . A method of forming a component for an electronic device, comprising:
 joining a metal portion including a first material having a first material property to a second portion including a second material having a second material property independent of the first material property;   forming one or more features in the second portion; and   treating a surface defined by the metal portion and the second portion to form an engagement feature.   
     
     
         9 . The method of  claim 10 , further comprising molding a material to the surface to mechanically engage the engagement feature. 
     
     
         10 . The method of  claim 10 , wherein joining comprises welding, brazing, diffusion bonding, adhering, or die casting the second material into the metal portion. 
     
     
         11 . The method of  claim 10 , wherein treating the surface comprises etching the surface or depositing material onto the surface. 
     
     
         12 . A housing for a portable electronic device, comprising:
 a first sidewall portion at least partially defining an internal volume and an external surface of the electronic device, the first sidewall portion comprising:
 a metal outer portion comprising a first material having a first set of material properties, the metal outer portion at least partially defining a first engagement feature; 
 an inner portion bonded to the metal outer portion, the inner portion comprising a second material having a second set of material properties independent of the first set of material properties, the inner portion at least partially defining the first engagement feature; 
   a second sidewall portion at least partially defining the internal volume and the external surface, the second sidewall portion defining a second engagement feature; and   a moldable material mechanically engaging the first engagement feature and the second engagement feature to join the first sidewall portion to the second sidewall portion.   
     
     
         13 . The housing of  claim 12 , wherein:
 the metal outer portion is a first metal outer portion;   the inner portion is a first inner portion;   the second sidewall portion comprises a second metal outer portion comprising the first material bonded to a second inner portion comprising the second material.   
     
     
         14 . The housing of  claim 13 , wherein the second engagement feature is defined by the second metal outer portion and the second inner portion. 
     
     
         15 . The housing of  claim 12 , wherein the first material has a higher hardness than the second material. 
     
     
         16 . The housing of  claim 12 , wherein the first material comprises steel and the second material comprises aluminum. 
     
     
         17 . The housing of  claim 12 , wherein the first material comprises titanium and the second material comprises aluminum. 
     
     
         18 . The housing of  claim 12 , wherein at least one of the first engagement feature or the second engagement feature is micro-structured. 
     
     
         19 . The housing of  claim 12 , wherein the first engagement feature comprises a recess. 
     
     
         20 . The housing of  claim 12 , wherein the moldable material comprises a polymer.