Vapor chamber structure
Abstract
A vapor chamber structure includes: a first plate body and a second plate body, which are mechanically processed and thinned, the first plate body having a first side, a second side and an opening, the second plate body having a third side and a fourth side, the first and second plate bodies being correspondingly mated with each other to define an airtight chamber, a working liquid being filled in the airtight chamber; a heat conduction block disposed at the opening, the heat conduction block having a first face and a second face; a first capillary structure layer disposed on the first side of the first plate body; and a second capillary structure layer formed on the second face of the heat conduction block. In case the first and second plate bodies are thinned to cause insufficient structural strength and planarity, the heat conduction block can reinforce the vapor chamber structure.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A vapor chamber structure comprising:
a first plate body and a second plate body, which are mechanically processed and thinned, the first plate body having a first side, a second side and an opening, the second plate body having a third side and a fourth side, the first and second plate bodies being correspondingly mated with each other to define an airtight chamber, a working liquid being filled in the airtight chamber; a heat conduction block correspondingly disposed at the opening, the heat conduction block having a first face and a second face; a first capillary structure layer disposed on the first side of the first plate body; and a second capillary structure layer formed on the second face of the heat conduction block, the first capillary structure layer and the second capillary structure layer being connected with each other or disconnected from each other.
2 . The vapor chamber structure as claimed in claim 1 , wherein the first plate body has a raised section protruding from the first side to the second side, the opening being correspondingly disposed on the raised section, a dent being formed on the first side corresponding to the raised section, the heat conduction block being flush with the dent or lower than the dent.
3 . The vapor chamber structure as claimed in claim 1 , wherein the first capillary structure layer and the second capillary structure layer are selected from a group consisting of sintered powder, mesh body, channeled body and fiber body.
4 . The vapor chamber structure as claimed in claim 1 , wherein the heat conduction block and the first and second plate bodies are made of a material selected from a group consisting of gold, silver, iron, copper, aluminum, stainless steel, copper alloy, aluminum alloy, titanium, titanium alloy, commercial pure titanium and ceramic material.
5 . The vapor chamber structure as claimed in claim 1 , further comprising a third capillary structure layer, the third capillary structure layer being disposed in the airtight chamber and stacked with the first and second plate bodies.
6 . The vapor chamber structure as claimed in claim 5 , wherein the third capillary structure layer is selected from a group consisting of sintered powder, mesh body and fiber body.
7 . The vapor chamber structure as claimed in claim 1 , wherein the heat conduction block is connected with the first plate body by means of welding, press fit or adhesion.
8 . The vapor chamber structure as claimed in claim 2 , wherein the heat conduction block is attached to a surface of the raised section corresponding to the opening.
9 . The vapor chamber structure as claimed in claim 2 , wherein the heat conduction block is inlaid in the opening on the raised section.
10 . The vapor chamber structure as claimed in claim 1 , wherein the heat conduction block is inlaid in the opening.Join the waitlist — get patent alerts
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