Electrochromic devices

Abstract

Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices.

What is claimed is: 
     
         1 . An integrated deposition system for fabricating an electrochromic window, the system comprising:
 a) a plurality of closely associated sputter targets operable to pass a substrate from one sputter to the next without exposing the substrate to an external environment, wherein the plurality of closely associated sputter targets comprise (i) a first sputter target containing a material source for depositing an electrochromic material; and (ii) a second sputter target containing a material source for depositing a counter electrode material; and   b) a controller containing program instructions for passing the substrate by the plurality of closely associated sputter targets in a manner that deposits on the substrate a single layer graded composition including: (i) an electrochromic region and (ii) a counter electrode region.   
     
     
         2 . The system of  claim 1 , operable to pass the substrate past the plurality of closely associated sputter targets without breaking vacuum. 
     
     
         3 . The system of  claim 1 , configured to deposit the single layer graded composition on an architectural glass substrate of at least six feet by ten feet. 
     
     
         4 . The system of  claim 3 , further comprising a substrate holder and transport mechanism operable to hold the architectural glass substrate in a substantially vertical orientation while in the system. 
     
     
         5 . The system of  claim 1 , further comprising one or more load locks for passing the substrate between an external environment and the integrated deposition system. 
     
     
         6 . The system of  claim 1 , further comprising one or more lithium deposition stations, each comprising a lithium-containing material source. 
     
     
         7 . The system of  claim 6 , comprising at least two lithium deposition stations. 
     
     
         8 . The system of  claim 6 , further comprising at least one slit valve operable to permit isolation a lithium deposition station, apart from the plurality of closely associated sputter targets. 
     
     
         9 . The system of  claim 1 , further comprising a third sputter target containing a material source for depositing an ion conducting material, wherein the single layer graded composition further includes an ion conducting region between the electrochromic region and the counter electrode region.