Antenna module and method of manufacturing the same

Abstract

An antenna module includes: an integrated circuit (IC) configured to generate a radio frequency (RF) signal; and a substrate including an antenna portion providing a first surface of the substrate, and a circuit pattern portion providing a second surface of the substrate. The antenna portion includes first antenna members configured to transmit the RF signal, cavities corresponding to the first antenna members, through vias respectively disposed in the cavities and respectively electrically connected to the first antenna members, and a plating member disposed in at least one cavity among the cavities. The circuit pattern portion includes a circuit pattern and an insulating layer forming, for each of the through vias, an electrical connection path to the IC.

What is claimed is: 
     
         1 . An antenna module, comprising:
 an insulating member having a cavity surrounded by the insulating member;   a dielectric member disposed in the cavity and having a dielectric dissipation factor (Df) lower than a Df of the insulating member; and   an antenna member disposed on the dielectric member and configured to remotely transmit and/or receive an RF signal.   
     
     
         2 . The antenna module of  claim 1 , wherein the dielectric member includes quartz or teflon. 
     
     
         3 . The antenna module of  claim 1 , further comprising a through via disposed to penetrate through the dielectric member and providing a path of the RF signal to the antenna member. 
     
     
         4 . The antenna module of  claim 1 , further comprising an encapsulation member disposed on the dielectric member,
 wherein the antenna member is disposed between the encapsulation member and the dielectric member.   
     
     
         5 . The antenna module of  claim 4 , further comprising a second antenna member disposed in the encapsulation member,
 wherein upper surfaces of the second antenna member and the encapsulation member form a common planar surface.   
     
     
         6 . The antenna module of  claim 5 , wherein the second antenna member is configured as second antenna members disposed to be spaced apart from each other. 
     
     
         7 . The antenna module of  claim 4 , wherein the dielectric member is configured as dielectric members disposed to be spaced apart from each other, and
 a portion of the encapsulation member is disposed between the dielectric members.   
     
     
         8 . The antenna module of  claim 1 , wherein the cavity is configured as cavities respectively surrounded by the insulating member, and
 the dielectric member is configured as dielectric members disposed in the cavities.   
     
     
         9 . The antenna module of  claim 8 , further comprising a plating member disposed to respectively surround the dielectric members. 
     
     
         10 . The antenna module of  claim 1 , further comprising a plating member disposed between the insulating member and the dielectric member. 
     
     
         11 . The antenna module of  claim 10 , further comprising shielding vias disposed in the dielectric member,
 wherein the antenna member is configured as antenna members disposed to be spaced apart from each other and disposed to do not overlap the shielding vias in extending directions of the shielding vias.   
     
     
         12 . The antenna module of  claim 1 , wherein the antenna member is configured as antenna members disposed to be spaced apart from each other. 
     
     
         13 . The antenna module of  claim 1 , further comprising a circuit pattern portion disposed below the dielectric member and comprising a circuit pattern and an insulating layer, and
 wherein the Df of the dielectric member is lower than a Df of the insulating layer.   
     
     
         14 . An antenna module, comprising:
 a circuit pattern portion comprising a circuit pattern and an insulating layer;   a dielectric member disposed on one surface of the circuit pattern portion and having a dielectric dissipation factor (Df) lower than a Df of the insulating layer; and   an antenna member disposed on the dielectric member and configured to remotely transmit and/or receive an RF signal.   
     
     
         15 . The antenna module of  claim 14 , wherein the dielectric member includes quartz or teflon. 
     
     
         16 . The antenna module of  claim 14 , further comprising a through via disposed to penetrate through the dielectric member and providing a path of the RF signal to the antenna member. 
     
     
         17 . The antenna module of  claim 14 , further comprising an encapsulation member disposed on the dielectric member,
 wherein the antenna member is disposed between the encapsulation member and the dielectric member.   
     
     
         18 . The antenna module of  claim 17 , further comprising a second antenna member disposed in the encapsulation member,
 wherein upper surfaces of the second antenna member and the encapsulation member form a common planar surface.   
     
     
         19 . The antenna module of  claim 14 , further comprising a plating member surrounding the dielectric member,
 wherein the dielectric member is configured as dielectric members respectively surrounded by the plating member.   
     
     
         20 . The antenna module of  claim 14 , further comprising:
 a plating member surrounding the dielectric member; and   shielding vias disposed in the dielectric member,   wherein the antenna member is configured as antenna members disposed to be spaced apart from each other and disposed to do not overlap the shielding vias in extending directions of the shielding vias.