Stacked light-receiving sensor and electronic device

Abstract

Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300), a second substrate (120, 320) bonded to the first substrate, and connection wiring (402) bonded to the second substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are arranged in a two-dimensional matrix. The second substrate includes a converter (17A) configured to convert an analog pixel signal output from the pixel array to digital image data and a processing unit (14) configured to perform a process for data based on the image data. At least a part of the converter is disposed on a first side in the second substrate. The processing unit is disposed on a second side opposite to the first side in the second substrate. The connection wiring is attached to a side other than the second side in the second substrate.

1 . A stacked light-receiving sensor comprising:
 a first substrate;   a second substrate bonded to the first substrate; and   connection wiring attached to the second substrate,   the first substrate including a pixel array in which a plurality of unit pixels are arranged in a two-dimensional matrix,   the second substrate including
 a converter configured to convert an analog pixel signal output from the pixel array to digital image data and 
 a processing unit configured to perform a process for data based on the image data, wherein 
   at least a part of the converter is disposed on a first side in the second substrate,   the processing unit is disposed on a second side opposite to the first side in the second substrate, and   the connection wiring is attached to a side other than the second side in the second substrate.   
     
     
         2 . The stacked light-receiving sensor according to  claim 1 , wherein the connection wiring is a flexible cable. 
     
     
         3 . The stacked light-receiving sensor according to  claim 1 , wherein the processing unit performs the process based on a neural network calculation model for data based on the image data. 
     
     
         4 . An in-vehicle imaging device comprising a solid-state imaging device, a circuit board provided with an information processing device, and connection wiring connecting the solid-state imaging device and the circuit board,
 the solid-state imaging device including
 a first substrate and 
 a second substrate bonded to the first substrate, 
   the first substrate including a pixel array in which a plurality of unit pixels are arranged in a two-dimensional matrix,   the second substrate including
 a converter configured to convert an analog pixel signal output from the pixel array to digital image data and 
 a processing unit configured to perform a process for data based on the image data, wherein 
   at least a part of the converter is disposed on a first side in the second substrate,   the processing unit is disposed on a second side opposite to the first side in the second substrate,   the connection wiring is attached to a side other than the second side in the second substrate and attached to a third side of the circuit board,   the solid-state imaging device is installed inside a vehicle such that a light-receiving surface of the pixel array faces a front direction of the vehicle and the first side is positioned on a lower side in a vertical direction, and   the circuit board is installed such that at least an end on a front side of the vehicle in the circuit board protrudes to the front direction of the vehicle relative to an end on the front side of the vehicle of the solid-state imaging device and a main plane is parallel or substantially parallel to a horizontal plane.   
     
     
         5 . The in-vehicle imaging device according to  claim 4 , wherein
 one end of the connection wiring is attached to the side on the lower side in the vertical direction in the second substrate of the solid-state imaging device, and   another end of the connection wiring is attached to an end on a rear side of the vehicle in the circuit board.   
     
     
         6 . The in-vehicle imaging device according to  claim 4 , wherein the information processing device is positioned on the front side of the vehicle relative to the solid-state imaging device. 
     
     
         7 . An in-vehicle imaging device comprising a solid-state imaging device, a circuit board provided with an information processing device, and connection wiring connecting the solid-state imaging device and the circuit board,
 the solid-state imaging device including
 a first substrate and 
 a second substrate bonded to the first substrate, 
   the first substrate including a pixel array in which a plurality of unit pixels are arranged in a two-dimensional matrix,   the second substrate including
 a converter configured to convert an analog pixel signal output from the pixel array to digital image data, and 
 a processing unit configured to perform a process for data based on the image data, wherein 
   at least a part of the converter is disposed on a first side in the second substrate,   the processing unit is disposed on a second side opposite to the first side in the second substrate,   the connection wiring is attached to a side other than the second side in the second substrate and attached to a third side of the circuit board, and   the solid-state imaging device is installed inside a vehicle such that a light-receiving surface of the pixel array faces a rear direction of the vehicle.   
     
     
         8 . The in-vehicle imaging device according to  claim 7 , wherein the circuit board is installed inside the vehicle to be positioned on a surface side opposite to the light-receiving surface in the solid-state imaging device.