Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers

Abstract

The present disclosure provides a method of creating a bond between a first object and a second object. For example, at least one insert may be provided at a location in a space formed between the first object and the second object. In additional, a filler material may be provided proximal to the location. An inter-diffusion layer may be formed, wherein a first portion of the inter-diffusion layer is formed by diffusion between the filler material and the at least one insert, wherein a second portion of the inter-diffusion layer is formed between the filler material and the first object, wherein a third portion of the inter-diffusion layer is formed between the filler material and the second object, wherein the first portion is coadunate with each of the second portion and third portion.

What is claimed is: 
     
         1 . An electronic module comprising:
 a substrate;   at least one chip;   a plurality of inserts comprising:
 a first set of inserts placed inside a space between the substrate and the at least one chip, 
 a second set of inserts placed inside a space formed by the substrate, the at least one chip and the first set of inserts,
 wherein diffusion of the second set of inserts occurs into at least one of the following: the substrate's mating surface, the at least one chip's mating surface and the first set of inserts; 
 
   a gap between the first set of the inserts and the substrate; and   a gap between the first set of inserts and the at least one chip,
 wherein the diffusion results in formation of at least one of the following: a coadunate inter-diffusion layer along at least one insert of the first set of inserts to the at least one chip and a coadunate inter-diffusion layer along at least one insert of the first set of the inserts to the substrate. 
   
     
     
         2 . The electronic module of lain  1 , wherein the at least one insert of the first set of inserts is comprised in at least one of the substrate's mating surface and the chip's mating surface. 
     
     
         3 . The electronic module of  claim 1 , wherein the at least one insert of the first set of inserts and the second set of inserts comprises a mesh screen. 
     
     
         4 . The electronic module of  claim 1 , wherein at least one of the coadunate interdiffusion layers is formed through applying a minimum processing pressure of zero. 
     
     
         5 . The electronic module of  claim 1 , wherein the at least one insert of the first set of inserts and the second set of inserts feature comprises a columnar structure. 
     
     
         6 . The electronic module of  claim 1 , wherein at least one insert feature of the first set of inserts comprises a plurality of volumetrically dispersed insert features. 
     
     
         7 . The electronic module of  claim 1 , wherein at least one of the following: the first set of inserts and the second set of inserts is integrally formed with at least one of the following: the substrate and the at least one chip. 
     
     
         8 . The electronic module of  claim 1 , wherein at least one of the following: the first set of inserts and the second set of inserts is subjected to a sintering process. 
     
     
         9 . The electronic module of  claim 1 , wherein at least one of the following: the first set of inserts and the second set of inserts is subjected to a soldering process. 
     
     
         10 . An electronic module comprising:
 a first object;   a second object;   at least one insert at a location in a space formed between the first object and the second object;   a filler material proximal to the location; and   an inter-diffusion layer, wherein a first portion of the inter-diffusion layer is formed by diffusion between the filler material and the at least one insert, wherein a second portion of the inter-diffusion layer is formed between the filler material and the first object, wherein a third portion of the inter-diffusion layer is formed between the filler material and the second object, wherein the first portion is coadunate with each of the second portion and third portion.   
     
     
         11 . The electronic module of  claim 10 , wherein the at least one insert is comprised in at least one of the following: the first object and the second object. 
     
     
         12 . The electronic module of  claim 10 , wherein the at least one insert comprises a mesh screen. 
     
     
         13 . The electronic module of  claim 10 , wherein forming the coadunate interdiffusion layer comprises applying a minimum processing pressure of zero. 
     
     
         14 . The electronic module of  claim 10 , wherein the at least one insert comprises a columnar structure. 
     
     
         15 . The electronic module of  claim 10 , wherein the at least one insert comprises a plurality of volumetrically dispersed insert features. 
     
     
         16 . The electronic module of  claim 10 , wherein the at least one insert is integrally disposed with at least one of the following: the first object and the second object. 
     
     
         17 . The electronic module of  claim 10 , wherein at least one insert is subjected to a sintering process. 
     
     
         18 . The electronic module of  claim 10 , wherein the filler material comprises nanoparticulate silver, further wherein the at least one insert comprises gold. 
     
     
         19 . The electronic module of  claim 10 , wherein the at least one insert to a soldering process. 
     
     
         20 . A method of creating a bond between a first object and a second object, the method comprising:
 placing at least one insert at a location in a space formed between the first object and the second object;   introducing a filler material proximal to the location; and   forming a plurality of inter-diffusion layers, wherein a first inter-diffusion layer is formed between the filler material, the at least one insert and the first object, wherein a second inter-diffusion layer is formed between the filler material, the at least one insert and the second object.