Manufacturing method of chip package structure

Abstract

A chip package structure includes a circuit structure, a redistribution structure, a heat conductive component, a chip, and a heat sink. The circuit structure includes a first circuit layer. The redistribution structure is disposed on the circuit structure and includes a second circuit layer, wherein the redistribution structure has an opening. The heat conductive component is disposed on the circuit structure and covered by the redistribution structure. The heat conductive component has a horizontal portion and a vertical portion. The horizontal portion extends toward the opening until it exceeds the opening. The vertical portion extends upward beyond the top surface of the redistribution structure from a part of the horizontal portion. The chip is disposed in the opening, and the bottom of the chip contacts the heat conductive component. The heat sink is disposed over the redistribution structure and the chip.

What is claimed is: 
     
         1 . A method for manufacturing a chip package, the method comprising the operations of:
 (i) providing a precursor structure, wherein the precursor structure comprises:   a circuit structure comprising a first circuit layer;   a redistribution precursor structure disposed on the circuit structure and comprising a second circuit layer electrically connected with the first circuit layer;   a heat conductive component disposed over the circuit structure and comprising:   a horizontal portion embedded in the redistribution precursor structure; and   a vertical portion extending upward from the horizontal portion and beyond a top surface of the redistribution precursor structure; and   a patterned release film disposed on the circuit structure and covered by the redistribution precursor structure, wherein the patterned release film covers a part of the horizontal portion of the heat conductive component and a connection pad electrically connected with the first circuit layer;   (ii) removing the patterned release film and a part of the redistribution precursor structure above the patterned release film to form an opening, wherein the opening exposes the connection pad and the part of the horizontal portion of the heat conductive component;   (iii) disposing a chip in the opening, wherein the chip is electrically connected to the connection pad and a bottom of chip contacts the part of the horizontal portion of the heat conductive component; and   (iv) attaching a heat sink to the chip and the vertical portion of the heat conductive component.   
     
     
         2 . The method according to  claim 1 , wherein the operation (iv) is performed by ultrasonic welding. 
     
     
         3 . The method according to  claim 1 , wherein the operation (ii) comprises:
 (a) employing a laser drilling process to remove a part of the redistribution precursor structure which is in a vertical projection of a periphery of the patterned release film; and   (b) removing the patterned release film and the part of the redistribution precursor structure above the patterned release film.   
     
     
         4 . The method according to  claim 1 , wherein the operation (i) comprises the steps of:
 (v) forming the horizontal portion of the heat conductive component on the circuit structure;   (vi) forming the redistribution precursor structure to cover the horizontal portion of the heat conductive component;   (vii) patterning the redistribution precursor structure to form a through hole exposing a part of the horizontal portion of the heat conductive component; and   (viii) forming the vertical portion of the heat conductive component in the through hole.