US2021156044A1PendingUtilityA1

Crystal grain size reduction method for plating film

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Assignee: TOYOHASHI PLATING CO LTDPriority: Dec 15, 2017Filed: Dec 14, 2018Published: May 27, 2021
Est. expiryDec 15, 2037(~11.4 yrs left)· nominal 20-yr term from priority
Inventors:Mikiharu Takagi
C25D 15/00C25D 3/48C25D 3/12C25D 5/617C25D 3/30C25D 3/46
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Claims

Abstract

In a crystal grain size reduction method for a plating film, electroplating is performed in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A crystal grain size reduction method for a plating film comprising:
 performing electroplating in a condition where ions of a plating metal, a nanocarbon, and an anion based surfactant as a dispersion agent for dispersing the nanocarbon have been blended in a plating solution.   
     
     
         2 . The crystal grain size reduction method for the plating film according to  claim 1 , wherein the nanocarbon is positively charged when in the blended state with the plating solution. 
     
     
         3 . The crystal grain size reduction method for the plating film according to  claim 1 , wherein the plating metal is one of silver, nickel, tin, or gold. 
     
     
         4 . The crystal grain size reduction method for the plating film according to  claim 2 , wherein the plating metal is one of silver, nickel, tin, or gold.

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