Method for plating a metallic material onto a titanium substrate

Abstract

A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.

1 . A method for plating a metallic material onto a titanium substrate, said titanium substrate comprising an outer surface and an oxide layer on said outer surface, said method comprising:
 chemically etching said outer surface of said titanium substrate to remove at least a portion of said oxide layer, thereby yielding an etched titanium substrate;   establishing a cathodic protection current through said etched titanium substrate while said etched titanium substrate is immersed in a cathodic electrolyte solution;   strike plating a bond promoter layer onto said outer surface of said etched titanium substrate after said establishing said cathodic protection current; and   plating said metallic material onto said bond promoter layer.   
     
     
         2 . The method of  claim 1  wherein said metallic material is an electrically conductive and lubricious material comprising at least one of indium and tin. 
     
     
         3 . The method of  claim 1  wherein said metallic material is a sacrificial material comprising at least one of cadmium, zinc and nickel. 
     
     
         4 . The method of  claim 1  wherein said metallic material is a high reflectivity material comprising at least one of aluminum and gold. 
     
     
         5 . The method of  claim 1  wherein said metallic material is a wear-resistant material comprising at least one of chromium and nickel. 
     
     
         6 . The method of  claim 1  further comprising cleaning said outer surface of said titanium substrate prior to said chemically etching. 
     
     
         7 - 8 . (canceled) 
     
     
         9 . The method of  claim 1  further comprising abrading said outer surface of said titanium substrate prior to said chemically etching. 
     
     
         10 . The method of  claim 9  wherein said abrading comprises blasting said titanium substrate with an abrasive medium having a grit size of at least about 60 microns. 
     
     
         11 - 13 . (canceled) 
     
     
         14 . The method of  claim 1  wherein said chemically etching comprises immersing said titanium substrate in an activation solution. 
     
     
         15 . The method of  claim 14  wherein said activation solution comprises at least one of fluoride ions and sodium fluoride. 
     
     
         16 . The method of  claim 14  wherein said activation solution comprises from about 2 grams to about 8 grams of sodium fluoride per liter of activation solution. 
     
     
         17 . The method of  claim 14  wherein said activation solution comprises at least one of a complexing agent and citric acid. 
     
     
         18 . The method of  claim 14  wherein said activation solution comprises at least about 30 grams of citric acid per liter of activation solution. 
     
     
         19 . The method of  claim 14  wherein said activation solution comprises sulfuric acid. 
     
     
         20 . The method of  claim 14  wherein said activation solution comprises at least about 50 grams of sulfuric acid per liter of activation solution. 
     
     
         21 . The method of  claim 14  further comprising establishing an anodic etching current through said titanium substrate while said titanium substrate is immersed in said activation solution. 
     
     
         22 . The method of  claim 21  wherein said establishing said anodic etching current comprises establishing an anodic etching current having a current density of at least about 2 amps per square foot. 
     
     
         23 . The method of  claim 21  wherein said establishing said anodic etching current comprises establishing said anodic etching current through said titanium substrate for at least about 150 seconds. 
     
     
         24 . (canceled) 
     
     
         25 . The method of  claim 1  further comprising rinsing said etched titanium substrate prior to said establishing said cathodic protection current. 
     
     
         26 - 27 . (canceled) 
     
     
         28 . The method of  claim 25  wherein said rinsing comprises rinsing said etched titanium substrate with an aqueous solution having a pH between about 3 to about 5. 
     
     
         29 . The method of  claim 1  wherein said cathodic electrolyte solution comprises at least one of nickel ions and copper ions. 
     
     
         30 . The method of  claim 1  wherein said cathodic electrolyte solution comprises nickel sulfate hexahydrate. 
     
     
         31 . The method of  claim 1  wherein said cathodic electrolyte solution comprises a complexing agent. 
     
     
         32 . The method of  claim 1  wherein said cathodic electrolyte solution comprises at least one of citric acid and sodium citrate. 
     
     
         33 . The method of  claim 1  wherein said establishing said cathodic protection current comprises applying a constant voltage of about 0 volts. 
     
     
         34 . The method of  claim 1  wherein said establishing said cathodic protection current comprises establishing said cathodic protection current for at least about 15 seconds. 
     
     
         35 . The method of  claim 1  wherein said strike plating comprises applying a strike current to said etched titanium substrate, said strike current having a current density of at least about 50 amps per square foot. 
     
     
         36 . The method of  claim 1  wherein said strike plating comprises applying a strike current for at least about 120 seconds. 
     
     
         37 . A method for plating a metallic material onto a titanium substrate, said titanium substrate comprising an outer surface and an oxide layer on said outer surface, said method comprising:
 abrading said outer surface of said titanium substrate;   chemically etching said outer surface of said titanium substrate to remove at least a portion of said oxide layer, thereby yielding an etched titanium substrate;   rinsing said etched titanium substrate;   establishing a cathodic protection current through said etched titanium substrate while said etched titanium substrate is immersed in a cathodic electrolyte solution;   strike plating a bond promoter layer onto said outer surface of said etched titanium substrate after said establishing said cathodic protection current; and   plating said metallic material onto said bond promoter layer.   
     
     
         38 . A method for plating a metallic material onto a titanium substrate, said titanium substrate comprising an outer surface and an oxide layer on said outer surface, said method comprising:
 etching said outer surface of said titanium substrate to yield an etched titanium substrate, said etching comprising immersing said titanium substrate in an activation solution and establishing an anodic etching current through said titanium substrate while said titanium substrate is immersed in said activation solution;   establishing a cathodic protection current through said etched titanium substrate while said etched titanium substrate is immersed in a cathodic electrolyte solution;   strike plating a bond promoter layer onto said outer surface of said etched titanium substrate after said establishing said cathodic protection current; and   plating said metallic material onto said bond promoter layer.