Pixel modules with controllers and light emitters

Abstract

An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

1 . A pixel module, comprising:
 a module substrate having a light-emitter surface and a controller surface opposed to the light-emitter surface;   one or more light emitters disposed on the light-emitter surface of the module substrate;   a controller native to the module substrate and constructed in or on the controller surface of the module substrate; and   module electrodes, wherein at least one of the module electrodes is electrically connected to the controller and at least one of the module electrodes is electrically connected to each light emitter of the one or more light emitters.   
     
     
         2 . The pixel module of  claim 1 , wherein the module electrodes electrically connect the controller to the one or more light emitters so that the controller is operable to control the one or more light emitters. 
     
     
         3 . The pixel module of  claim 1 , wherein one or more of the module electrodes pass through the module substrate or wrap around an edge of the module substrate. 
     
     
         4 . (canceled) 
     
     
         5 . The pixel module of  claim 1 , wherein the one or more light emitters comprise a red-light emitter operable to emit red light, a green-light emitter operable to emit green light, and a blue-light emitter operable to emit blue light. 
     
     
         6 . The pixel module of  claim 1 , wherein the one or more light emitters are one or more horizontal inorganic light-emitting diodes that are disposed to emit light in a direction away from the light-emitter surface of the module substrate. 
     
     
         7 . The pixel module of  claim 6 , wherein the horizontal inorganic light-emitting diodes comprise a top side opposite a bottom side and emit light through the top side, wherein light-emitter electrodes are electrically connected to the top side. 
     
     
         8 . The pixel module of  claim 6 , wherein the horizontal inorganic light-emitting diodes comprise a bottom side opposite a top side and emit light through the bottom side, wherein light-emitter electrodes are electrically connected to the top side. 
     
     
         9 . The pixel module of  claim 1 , wherein the one or more light emitters are one or more vertical inorganic light-emitting diodes that are disposed to emit light in a direction away from the light-emitter surface of the module substrate. 
     
     
         10 . The pixel module of  claim 1 , wherein each light emitter of the one or more light emitters comprises one or more light-emitter connection posts each electrically connected to one of the module electrodes. 
     
     
         11 . (canceled) 
     
     
         12 . The pixel module of  claim 1 , comprising one or more module connection posts disposed on the controller surface of the module substrate, each of the one or more module connection posts electrically connected to one of the module electrodes. 
     
     
         13 - 14 . (canceled) 
     
     
         15 . The pixel module of  claim 1 , comprising one or more module connection posts disposed on and protruding from the light-emitter surface of the module substrate, each of the one or more module connection posts electrically connected to one of the module electrodes. 
     
     
         16 - 19 . (canceled) 
     
     
         20 . The pixel module of  claim 1 , wherein (i) each light emitter of the one or more light emitters comprises a broken or separated light-emitter tether, (ii) the module substrate comprises a module tether, or (iii) (i) and (ii). 
     
     
         21 . The pixel module of  claim 1 , wherein the module substrate comprises a broken or separated module tether. 
     
     
         22 . The pixel module of  claim 1 , wherein each of the one or more light emitters is non-native to the module substrate. 
     
     
         23 . The pixel module of  claim 1 , wherein a dielectric is disposed between the at least one light emitter and at least a portion of each of the at least one of the module electrodes. 
     
     
         24 . The pixel module of  claim 1 , comprising (i) an encapsulating layer disposed over the controller, (ii) an encapsulating layer disposed over the one or more light emitters, or (iii) both (i) and (ii). 
     
     
         25 . The pixel module of  claim 24 , wherein any one or more of the encapsulating layers comprises a broken or separated module tether. 
     
     
         26 . The pixel module of  claim 24 , comprising one or more module connection posts disposed on and protruding from the module substrate and wherein the one or more module connection posts protrude through any one or more of the encapsulating layer disposed over the controller and the encapsulating layer disposed over the one or more light emitters. 
     
     
         27 . The pixel module of  claim 24 , wherein the pixel module is fully encapsulated by any one or more of the encapsulating layers. 
     
     
         28 . The pixel module of  claim 1 , wherein the pixel module has at least one of:
 at least one of a width and a length of no more than 400 microns, and   a thickness of no more than 150 microns.   
     
     
         29 - 128 . (canceled) 
     
     
         129 . The pixel module of  claim 27 , wherein the pixel module is fully encapsulated by any one or more of the encapsulating layers and the module substrate.