Image sensor flip chip package

Abstract

Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.

What is claimed is: 
     
         1 . A semiconductor package comprising:
 a semiconductor device comprised within a cavity within a glass block;   a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block;   one or more traces extending along one or more of the two or more edges of the glass block;   an opaque material between a side surface of the semiconductor device and an inner surface of the cavity over the one or more traces; and   an air gap between the glass block and the semiconductor device;   wherein the opaque material is configured to block light from contacting the side surface of the semiconductor device.   
     
     
         2 . The semiconductor package of  claim 1 , further comprising one or more solder balls physically coupling the semiconductor device with the one or more traces. 
     
     
         3 . The semiconductor package of  claim 1 , further comprising a fill material comprised between the substrate and the semiconductor device. 
     
     
         4 . The semiconductor package of  claim 1 , wherein the semiconductor device is an image sensor. 
     
     
         5 . The semiconductor package of  claim 2 , further comprising two or more solder balls acting as two or more standoff structures between the inner cavity within the glass block and a second side of the semiconductor device. 
     
     
         6 . The semiconductor package of  claim 1 , wherein the cavity has a shape that is cuboidal. 
     
     
         7 . The semiconductor package of  claim 1 , wherein the substrate is physically coupled with the one or more traces through a solder ball. 
     
     
         8 . The semiconductor package of  claim 7 , wherein the solder ball is located outside a perimeter of the semiconductor device and outside a perimeter of the cavity in the glass block that correspondingly extends around the perimeter of the semiconductor device. 
     
     
         9 . A semiconductor package comprising:
 a semiconductor device comprised within a cavity within a glass block;   a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block;   one or more traces extending along one or more of the two or more edges of the glass block;   an opaque material between a side surface of the semiconductor device and an inner surface of the cavity; and   an air gap between the glass block and the semiconductor device;   wherein the opaque material is configured to block light from contacting the side surface of the semiconductor device.   
     
     
         10 . The semiconductor package of  claim 9 , further comprising one or more solder balls physically coupling the semiconductor device with the one or more traces. 
     
     
         11 . The semiconductor package of  claim 9 , further comprising a fill material comprised between the substrate and the semiconductor device. 
     
     
         12 . The semiconductor package of  claim 9 , wherein the semiconductor device is an image sensor. 
     
     
         13 . The semiconductor package of  claim 12 , further comprising two or more solder balls acting as two or more standoff structures between the inner cavity within the glass block and a second side of the semiconductor device. 
     
     
         14 . The semiconductor package of  claim 9 , wherein the cavity has a shape that is cuboidal. 
     
     
         15 . The semiconductor package of  claim 9 , wherein the substrate is physically coupled with the one or more traces and with two or more vias comprised in the semiconductor device through four or more solder balls. 
     
     
         16 . The semiconductor package of  claim 15 , wherein two of the four or more solder balls are located outside a perimeter of the semiconductor device and outside a perimeter of the cavity in the glass block that correspondingly extends around the perimeter of the semiconductor device. 
     
     
         17 . A method of forming a semiconductor package, the method comprising:
 forming a cavity within a glass block;   forming an air gap between the semiconductor device and glass block through coupling a semiconductor device into the cavity;   sealing the semiconductor device within the cavity using an opaque filling material;   mechanically and electrically coupling a substrate to the semiconductor device and over an opening of the cavity;   underfilling a gap between the substrate, the semiconductor device, and a side of the glass block surrounding the cavity with an underfill material;   wherein the opaque filling material is configured to block light from contacting an edge of the semiconductor device.   
     
     
         18 . The method of  claim 17 , further comprising coupling a ball grid array to a second side of the substrate. 
     
     
         19 . The method of  claim 17 , further comprising vias comprised within the semiconductor device. 
     
     
         20 . The package of  claim 17 , wherein mechanically and electrically coupling a substrate to the semiconductor device further comprises using solder balls.