Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods

Abstract

A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.

What is claimed is: 
     
         1 . A substrate processing system comprising:
 a factory interface;   a transfer chamber comprising:
 four first facets adapted for attachment to one or more first processing chambers; and 
 three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets; 
   a second processing chamber having a first interface attached to a first of the three second facets;   a load lock attached to a second of the three second facets, the load lock also attached to the factory interface; and   a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.   
     
     
         2 . The substrate processing system of  claim 1 , further comprising a degas chamber having a second interface attached to a third of the three second facets. 
     
     
         3 . The substrate processing system of  claim 2 , wherein the second of the three second facets is positioned between the first and the second of the three second facets. 
     
     
         4 . The substrate processing system of  claim 1 , further comprising the one or more first processing chambers, wherein the one or more first processing chambers are epitaxial deposition chambers. 
     
     
         5 . The substrate processing system of  claim 1 , wherein the load lock is one of a single, a batch, or a stacked load lock. 
     
     
         6 . The substrate processing system of  claim 1 , wherein the factory interface is laterally offset from a geometrical center of the transfer chamber. 
     
     
         7 . The substrate processing system of  claim 1 , wherein the robot comprises two arms, each attached to a separate end effector. 
     
     
         8 . The substrate processing system of  claim 1 , wherein the second processing chamber is one of a pre-processing chamber or a post-processing chamber. 
     
     
         9 . A substrate processing system comprising:
 a transfer chamber comprising:
 four first facets adapted for attachment to one or more first processing chambers; and 
 three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets; 
   a single robot attached to a bottom of the transfer chamber and adapted to pass substrates through the four first facets and the three second facets; and   an interface unit comprising an integral unit body that comprises:
 a mating piece having three interface sides to attach to the three second facets; 
 a second processing chamber having a first of the three interface sides; 
 a load lock having a second of the three interface sides; and 
 a third processing chamber having a third of the three interface sides. 
   
     
     
         10 . The substrate processing system of  claim 9 , wherein the load lock is positioned in a middle of the interface unit between the second processing chamber and the third processing chamber. 
     
     
         11 . The substrate processing system of  claim 9 , further comprising the one or more first processing chambers, wherein the one or more first processing chambers are epitaxial deposition chambers, and the second processing chamber and the third processing chamber are smaller than each of the one or more first processing chambers. 
     
     
         12 . The substrate processing system of  claim 9 , wherein the load lock is one of a single, a batch, or a stacked load lock. 
     
     
         13 . The substrate processing system of  claim 9 , further comprising a factory interface attached to the load lock. 
     
     
         14 . The substrate processing system of  claim 13 , wherein the factory interface is laterally offset from a geometrical center of the transfer chamber. 
     
     
         15 . The substrate processing system of  claim 9 , wherein the robot comprises two arms, each attached to a separate end effector. 
     
     
         16 . The substrate processing system of  claim 9 , wherein the second processing chamber is a pre-processing chamber and the third processing chamber is a post-processing chamber. 
     
     
         17 . A mainframe for a semiconductor manufacturing device comprising:
 a transfer chamber comprising:
 a bottom; 
 four first facets attached to the bottom, wherein each of the first four facets is adapted for attachment to a first processing chamber; 
 two second facets attached to the bottom, wherein each of the two second facets has a width that is narrower than that of each of the four first facets and is adapted for attachment to a second processing chamber that is smaller than the first processing chamber; 
 a single third facet attached to the bottom, wherein the single third facet is adapted for attachment to a load lock; and 
 a robot attached to the bottom, the robot adapted to transfer substrates to and from each first processing chamber, each second processing chamber, and the load lock. 
   
     
     
         18 . The mainframe of  claim 17 , wherein the single third facet is positioned between the two second facets and also has a width that is narrower than that of each of the four first facets. 
     
     
         19 . The mainframe of  claim 17 , wherein the load lock is one of a single, a batch, or a stacked load lock. 
     
     
         20 . The mainframe of  claim 17 , wherein the robot comprises two arms, each attached to a separate end effector, and wherein the two second facets each comprise an opening through which to insert and withdraw one of the two arms of the robot. 
     
     
         21 . The mainframe of  claim 17 , wherein the single third facet comprises slit openings through which to insert the substrates to and from the load lock.