Radiation-sensitive resin composition, cured film, pattern forming method, solid-state imaging device, and image display device

Abstract

Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.

What is claimed is: 
     
         1 . A radiation-sensitive resin composition comprising:
 a resin;   a polymerizable compound having an ethylenically unsaturated bond;   a photopolymerization initiator;   an organic solvent; and   water,   wherein the photopolymerization initiator includes an oxime ester compound A having at least one group selected from the group consisting of a branched alkyl group and a cyclic alkyl group and a compound other than the oxime ester compound A,   the oxime ester compound A is an oxime ester compound including a fluorine atom, and   the content of the water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.   
     
     
         2 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the resin includes an alkali-soluble resin.   
     
     
         3 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the polymerizable compound is a polyfunctional (meth)acrylate compound having an ethylenically unsaturated bond equivalent of 3.0 to 12.0 mmol/g.   
     
     
         4 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the oxime ester compound A has at least one group selected from the group consisting of a branched alkyl group having 7 or more carbon atoms and a cyclic alkyl group having 7 or more carbon atoms.   
     
     
         5 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the oxime ester compound A has a carbazole structure.   
     
     
         6 . The radiation-sensitive resin composition according to  claim 5 ,
 wherein the carbazole structure has a structure in which a ring is further fused with a benzene ring of a carbazole moiety.   
     
     
         7 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the oxime ester compound A is a compound represented by Formula (1),   
       
         
           
           
               
               
           
         
         in Formula (1), Ar 1  and Ar 2  each independently represent an aromatic hydrocarbon ring which may have a substituent, R 1  represent an aryl group having a group including a fluorine atom, and R 2  and R 3  each independently represent an alkyl group or an aryl group, provided that at least one of R 1  to R 3  is a branched alkyl group or a cyclic alkyl group, or at least one of R 1 , R 2 , R 3 , Ar 1 , or Ar 2  has a branched alkyl group or a cyclic alkyl group. 
       
     
     
         8 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the organic solvent is at least one selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, cyclohexanone, butyl acetate, ethyl-3-ethoxypropionate, propylene glycol monoethyl ether acetate, xylene, ethylbenzene, methyl isobutyl ketone, 2-butanol, and dipropylene glycol monomethyl ether.   
     
     
         9 . The radiation-sensitive resin composition according to  claim 1 , further comprising at least one selected from the group consisting of a chromatic coloring agent and an inorganic particle. 
     
     
         10 . The radiation-sensitive resin composition according to  claim 1 , further comprising an ultraviolet absorber. 
     
     
         11 . The radiation-sensitive resin composition according to  claim 1 , further comprising a thermosetting compound. 
     
     
         12 . The radiation-sensitive resin composition according to  claim 1 , further comprising a silicon-based surfactant. 
     
     
         13 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the compound other than the oxime ester compound A is at least one selected from the group consisting of an oxime ester compound having neither a branched alkyl group nor a cyclic alkyl group, an alkylphenone compound, and an acylphosphine compound.   
     
     
         14 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the compound other than the oxime ester compound A is an oxime ester compound having neither a branched alkyl group nor a cyclic alkyl group.   
     
     
         15 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the compound other than the oxime ester compound A is an alkylphenone compound.   
     
     
         16 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the oxime ester compound A is a compound represented by Formula (C-1),   
       
         
           
           
               
               
           
         
         the compound other than the oxime ester compound A is an oxime ester compound having neither a branched alkyl group nor a cyclic alkyl group, and 
         further comprising a silicon-based surfactant. 
       
     
     
         17 . The radiation-sensitive resin composition according to  claim 1 ,
 wherein the oxime ester compound A is a compound represented by Formula (C-1),   
       
         
           
           
               
               
           
         
         the compound other than the oxime ester compound A is an oxime ester compound having neither a branched alkyl group nor a cyclic alkyl group, 
         the resin includes a graft type polymer, and 
         further comprising a silicon-based surfactant and pigment. 
       
     
     
         18 . A cured film using the radiation-sensitive resin composition according to  claim 1 . 
     
     
         19 . The cured film according to  claim 18 ,
 wherein the transmittance of light at a wavelength of 365 nm is 15% or less.   
     
     
         20 . A pattern forming method comprising:
 forming a radiation-sensitive resin composition layer on a support using the radiation-sensitive resin composition according to  claim 1 ;   patternwise-exposing the radiation-sensitive resin composition layer; and   removing the unexposed areas by development to form a pattern.   
     
     
         21 . A solid-state imaging device comprising the cured film according to  claim 18 . 
     
     
         22 . An image display device comprising the cured film according to  claim 18 .