Method and device for embossing of a nanostructure

Abstract

A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.

Having described the invention, the following is claimed: 
     
         1 . A device for embossing of a nanostructure from a nanostructure stamp into a stamp surface of a substrate, comprising:
 one or more pressure elements configured to prestress the nanostructure stamp during an imprint operation and make contact of a partial area of the stamp surface of the substrate with the nanostructure stamp during the imprint operation.   
     
     
         2 . The device of  claim 1 , wherein the pressure elements comprise one of a fluid and a gas. 
     
     
         3 . The device of  claim 1 , further comprising:
 a force sensor configured to control detachment of the nanostructure stamp and the stamp surface of the substrate during a separation operation carried out during the imprint operation.   
     
     
         4 . The device of  claim 1 , wherein the pressure elements comprise an actuator configured to mechanically bring the nanostructure into contact with the partial area of the stamp surface of the substrate. 
     
     
         5 . The device of  claim 1 , wherein the pressure elements comprise a pin configured to mechanically bring the nanostructure into contact with the partial area of the stamp surface of the substrate. 
     
     
         6 . The device of  claim 4 , wherein the actuator is pressurized with a fluid. 
     
     
         7 . The device of  claim 4 , wherein the actuator is pressurized with a gas. 
     
     
         8 . The device of  claim 5 , wherein the pin is pressurized with a fluid. 
     
     
         9 . The device of  claim 5 , wherein the pin is pressurized with a gas.