Polishing machine and method for polishing optical waveguides

Abstract

The invention relates to a polishing machine ( 10 ) and to a method for polishing optical waveguides, the polishing machine comprising a polishing disk ( 13 ) having a plug socket ( 14 ) for holding a plug with an optical waveguide, a polishing platform ( 15 ) for receiving an abrasive, a positioning device ( 17 ) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position ( 16 ), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, the positioning device having a holder ( 20 ) for detachably holding the polishing disk, wherein the polishing machine has a metering device for applying a rinsing liquid to the polishing platform, a passage opening through which the rinsing liquid is metered onto the polishing platform by means of the metering device being formed in the polishing disk.

1 . A polishing machine ( 10 ) for polishing optical waveguides, comprising a polishing disk ( 13 ) having a plug socket ( 14 ) for holding a plug with an optical waveguide, a polishing platform ( 15 ) for receiving an abrasive, a positioning device ( 17 ) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position ( 16 ), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, the positioning device having a holder ( 20 ) for detachably holding the polishing disk, characterized in that the polishing machine has a metering device for applying a rinsing liquid to the polishing platform, a passage opening through which the rinsing liquid is metered onto the polishing platform by means of the metering device being formed in the polishing disk. 
     
     
         2 . The polishing machine according to  claim 1 , characterized in that the metering device has a liquid reservoir, a metering pump, a supply line, a metering valve and a controller for a rinsing liquid. 
     
     
         3 . The polishing machine according to  claim 2 , characterized in that the liquid reservoir, the metering pump, the supply line and the metering valve form a modular metering unit which is removably disposed outside or within a housing ( 11 ) of the polishing machine ( 10 ). 
     
     
         4 . The polishing machine according to  claim 1 , characterized in that the holder ( 20 ) has a mount ( 21 ) for detachably holding the polishing disk ( 13 ), the mount being realized with a magnet for force-fitting holding and/or with a coupling for form-fitting holding of the polishing disk. 
     
     
         5 . The polishing machine according to  claim 4 , characterized in that the mount ( 21 ) permits an inclination of the polishing disk ( 13 ) at an angle of up to 2° relative to the polishing platform ( 15 ), the positioning device ( 17 ) having a force gauge for determining a contact pressure between the polishing disk and the polishing platform. 
     
     
         6 . The polishing machine according to  claim 4  or  5 , characterized in that the polishing disk ( 13 ) comprises a connecting protrusion ( 22 ) which is detachably connectable to the mount ( 21 ). 
     
     
         7 . The polishing machine according to  claim 4 , characterized in that a channel for conducting a rinsing liquid to the passage opening of the polishing disk ( 13 ) is formed in the mount ( 21 ). 
     
     
         8 . The polishing machine according to  claim 1 , characterized in that an atomizer valve of the metering device is disposed at the passage opening. 
     
     
         9 . The polishing machine according to  claim 1 , characterized in that a plurality of passage openings through which the rinsing liquid is metered onto the polishing platform ( 15 ) by means of the metering device are formed in the polishing disk ( 13 ). 
     
     
         10 . The polishing machine according to  claim 1 , characterized in that the polishing machine ( 10 ) has a cleaning device for applying dry ice to the polishing platform ( 15 ) and/or to the polishing disk ( 13 ). 
     
     
         11 . The polishing machine according to  claim 1 , characterized in that at least part of the polishing disk ( 13 ) and/or of the polishing platform ( 15 ) is coated with an amorphous carbon layer. 
     
     
         12 . The polishing machine according to  claim 1 , characterized in that the polishing machine ( 10 ) has a changer device, the changer device comprising a plurality of polishing pads each having an abrasive, the abrasives being different from each other, the polishing pads with the abrasives being stored in a magazine of the changer device and being arranged on and removed from the polishing platform ( 15 ) by means of a handling device of the changer device. 
     
     
         13 . A method for polishing optical waveguides using a polishing machine ( 10 ), an end of an optical fiber of an optical waveguide being polished, a plug with the optical waveguide being held in a plug socket ( 14 ) of a polishing disk ( 13 ), an abrasive being received on a polishing platform ( 15 ), the polishing disk and the polishing platform being moved relative to each other from a set-up position ( 16 ) into a polishing position by means of a positioning device ( 17 ), the polishing disk and the polishing platform being moved relative to each other in a polishing movement by a drive device when in the polishing position, the polishing disk being detachably held on a holder ( 20 ) of the positioning device, characterized in that a rinsing liquid is applied to the polishing platform by means of a metering device of the polishing machine, the metering device metering the rinsing liquid onto the polishing platform through a passage opening formed in the polishing disk. 
     
     
         14 . The method according to  claim 13 , characterized in that water, preferably distilled water, or a mixture of water and alcohol is used as a rinsing liquid. 
     
     
         15 . The method according to  claim 13 , characterized in that rinsing liquid is metered out before and/or during execution of a polishing movement. 
     
     
         16 . The method according to  claim 13 , characterized in that the rinsing liquid is metered onto the polishing platform ( 15 ) continuously or at intervals during execution of a polishing movement. 
     
     
         17 . The method according to according to  claim 13 , characterized in that the rinsing liquid flows from a center toward an edge of the polishing platform ( 15 ). 
     
     
         18 . The method according to according to  claim 13 , characterized in that dry ice is applied to the polishing platform ( 15 ) and/or to the polishing disk ( 13 ) by means of a cleaning device of the polishing machine ( 10 ). 
     
     
         19 . The method according to according to  claim 13 , characterized in that relative positioning of the polishing disk ( 13 ) and of the polishing platform ( 15 ), changing of polishing pads, execution of the polishing movement and/or metering of the rinsing liquid is controlled by means of a control device ( 12 ) of the polishing machine ( 10 ).