Heater unit for microfluidic diagnostic system

Abstract

The present technology provides for a heater substrate that contains networks of heater elements configured to controllably and selectively deliver heat to one or more PCR reaction chambers in a microfluidic substrate with which the heater substrate makes contact. In exemplary embodiments, the heater substrate can deliver heat to 12, 24, 48, or 96 chambers independently of one another, or simultaneously. The heater substrate is located in a heater unit that may be introduced into a diagnostic apparatus that can receive and position a microfluidic substrate, such as in a cartridge, in contact with the heater unit, receive one or more polynucleotide containing samples into one or more lanes in the microfluidic substrate, and cause amplification of the polynucleotides to occur, and detect presence of absence of specified polynucleotides in the amplified samples.

1 .- 23 . (canceled) 
     
     
         24 . A method of making a device comprising:
 providing a substrate;   attaching a heat sealable laminate layer to a bottom surface of the substrate using heat bonding;   attaching a thermal interface material layer to a bottom of the heat sealable laminate layer using pressure sensitive adhesive;   attaching a first plastic label with pressure sensitive adhesive to a top surface of the substrate at a first location; and   attaching a second plastic label with pressure sensitive adhesive to the top surface of the substrate at a second location.   
     
     
         25 . The method of  claim 24 , further comprising positioning a hydrophobic vent membrane between the substrate and the second plastic label. 
     
     
         26 . The method of  claim 24 , wherein the first plastic label is between about 50 and 150 microns thick. 
     
     
         27 . The method of  claim 24 , wherein the first plastic label seals a loading hole of a substrate. 
     
     
         28 . The method of  claim 24 , wherein the first plastic label traps air in the substrate. 
     
     
         29 . The method of  claim 24 , wherein the first plastic label serves as a location for operator markings. 
     
     
         30 . The method of  claim 24 , wherein the second plastic label is between about 50 and 150 microns thick. 
     
     
         31 . The method of  claim 24 , wherein the second plastic label serves as a location for operator markings. 
     
     
         32 . The method of  claim 24 , wherein the first plastic label and second plastic label are separate pieces. 
     
     
         33 . The method of  claim 24 , wherein the heat sealable laminate layer is between about 100 and 125 microns thick. 
     
     
         34 . The method of  claim 24 , wherein the thermal interface material layer is about 125 microns thick. 
     
     
         35 . The method of  claim 24 , wherein the thermal interface material layer has a higher thermal conductivity than plastic. 
     
     
         36 . The method of  claim 24 , wherein the heat sealable laminate layer covers the entire bottom surface of the substrate. 
     
     
         37 . The method of  claim 24 , wherein the thermal interface material layer covers the entire heat sealable laminate layer. 
     
     
         38 . The method of  claim 24 , wherein the first plastic label covers only a portion of the top surface of the substrate. 
     
     
         39 . The method of  claim 24 , wherein the second plastic label covers only a portion of the top surface of the substrate. 
     
     
         40 . The method of  claim 24 , wherein the first plastic label comprises a central opening. 
     
     
         41 . The method of  claim 24 , wherein the first plastic label comprises a tab. 
     
     
         42 . The method of  claim 24 , wherein the first plastic label and the second plastic label are spaced apart on the top surface of the substrate.