Quantum dot plate assembly and led package and module comprising the same

Abstract

Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting device and a lower surface of the first wavelength converting layer.

What is claimed is: 
     
         1 . A light transmitting device package comprising:
 a light emitting device;   a light transmitting plate body formed above the light emitting device and included a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate formed on an upper surfaces of the plurality of side light transmitting plates, and an empty portion;   a wavelength converting unit included a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed on the upper surface of the lower light transmitting plate; and   an adhesive layer formed between the light transmitting plate body and the light emitting device.   
     
     
         2 . The light emitting device package of  claim 1 , wherein the second wavelength converting layer is a QD phosphor including a particle having a smaller size than the particle of the first wavelength converting layer. 
     
     
         3 . The light emitting device package of  claim 1 , wherein the adhesive layer is formed on a lower surface of the first wavelength converting layer. 
     
     
         4 . The light emitting device package of  claim 1 , wherein the adhesive layer is formed integrally with the first wavelength converting layer. 
     
     
         5 . The light emitting device package of  claim 1 , wherein the adhesive layer comprises a light scattering agent. 
     
     
         6 . The light emitting device package of  claim 1 , wherein the adhesive layer is formed on at least one side of the light emitting device and has a predetermined slop on the at least one side of the light emitting device. 
     
     
         7 . The light emitting device package of  claim 1 , wherein the empty portion is in a vacuum state. 
     
     
         8 . The light emitting device package of  claim 1 , further comprising:
 a plurality of patterns is formed on the lower surface of the lower light transmitting plate.   
     
     
         9 . The light emitting device package of  claim 1 , further comprising:
 an insertion groove into which a part of the light emitting device is inserted.   
     
     
         10 . The light emitting device package of  claim 9 , wherein a width of the second wavelength converting layer is greater than a width of the insertion groove. 
     
     
         11 . The light emitting device package of  claim 1 , further comprising:
 a curvature portion having a curvature is formed at an edge of the lower surface of the lower light transmitting plate.   
     
     
         12 . The light emitting device package of  claim 11 , wherein the curvature portion has a shape protruding toward the empty portion. 
     
     
         13 . The light emitting device package of  claim 1 , wherein the side light transmitting plates are formed in a directional shape having a predetermined degree, and a width of the upper light transmitting plate is greater than a width of the lower light transmitting plate. 
     
     
         14 . The light emitting device package of  claim 13 , wherein the predetermined angle is 60° to 80°. 
     
     
         15 . The light emitting device package of  claim 1 , wherein the side light transmitting plates comprise a first welding region. 
     
     
         16 . The light emitting device package of  claim 15 , wherein the side light transmitting plates comprise a second welding region formed between the first welding region and the empty portion. 
     
     
         17 . The light emitting device package of  claim 16 , wherein the first welding region having a semi-elliptical shape and the second welding region having an elliptical shape. 
     
     
         18 . The light emitting device package of  claim 1 , further comprising:
 a reflector member surrounding the light emitting device and the light transmitting plate body.   
     
     
         19 . The light emitting device package of  claim 18 , wherein a loser surface of the light emitting device includes at least one electrode and the electrode is further protruded downward than a lower surface of the reflector member. 
     
     
         20 . The light emitting device package of  claim 18 , further comprising:
 a molding member formed between the light transmitting plate body and the reflector member.