Board having multilayer capacitor mounted thereon and multilayer capacitor package

Abstract

An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.

What is claimed is: 
     
         1 . An electronic component comprising:
 a board having first and second electrode pads on one surface of the board; and   a multilayer capacitor,   wherein the multilayer capacitor comprises:   a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board; and   external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively,   wherein Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.   
     
     
         2 . The electronic component according to  claim 1 , wherein the external electrodes comprise:
 connection portions disposed on both surfaces of the capacitor body in a longitudinal direction and connected to the exposed portions of the internal electrodes; and   bent portions extending from the connection portions to a portion of the mounting surface of the capacitor body.   
     
     
         3 . The electronic component according to  claim 1 , wherein the external electrodes further comprise:
 conductive layers; and   plating layers disposed on surfaces of the conductive layers.   
     
     
         4 . The electronic component according to  claim 3 , wherein the plating layers comprise:
 nickel plating layers disposed on the surfaces of the conductive layers; and   tin plating layers disposed on surfaces of the nickel plating layers.   
     
     
         5 . The electronic component according to  claim 1 , wherein the length of the multilayer capacitor is a dimension of the multilayer capacitor in a longitudinal direction,
 the plurality of internal electrodes are alternatively exposed from surfaces of the capacitor body in the longitudinal direction, and   the first and second electrode pads include inner edges facing each other in the longitudinal direction and opposing the outer edges in the longitudinal direction.   
     
     
         6 . An electronic component comprising:
 a board having first and second electrode pads on one surface of the board; and   a multilayer capacitor,   wherein the multilayer capacitor comprises:   a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed vertically with respect to a mounting surface of the capacitor body facing the one surface of the board; and   external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively,   wherein Lp/Lc>1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.   
     
     
         7 . The electronic component according to  claim 6 , wherein the external electrodes comprise:
 connection portions disposed on both surfaces of the capacitor body in a longitudinal direction and connected to the exposed portions of the internal electrodes; and   bent portions extending from the connection portions to a portion of the mounting surface of the capacitor body.   
     
     
         8 . The electronic component according to  claim 6 , wherein the external electrodes further comprise:
 conductive layers; and   plating layers disposed on surfaces of the conductive layers.   
     
     
         9 . The electronic component according to  claim 8 , wherein the plating layers comprise:
 nickel plating layers disposed on the surfaces of the conductive layers; and   tin plating layers disposed on surfaces of the nickel plating layers.   
     
     
         10 . The electronic component according to  claim 6 , wherein the length of the multilayer capacitor is a dimension of the multilayer capacitor in a longitudinal direction,
 the plurality of internal electrodes are alternatively exposed from surfaces of the capacitor body in the longitudinal direction, and   the first and second electrode pads include inner edges facing each other in the longitudinal direction and opposing the outer edges in the longitudinal direction.   
     
     
         11 . An electronic component comprising:
 a board having first and second electrode pads on one surface of the board; and   a multilayer capacitor,   wherein the multilayer capacitor comprises:   a capacitor body comprising a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween; and   external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively,   wherein when Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc, the dielectric layer and the internal electrodes are disposed horizontally with respect to the board, and when Lp/Lc>1.35, the dielectric layer and the internal electrodes are disposed vertically with respect to the board.   
     
     
         12 . The electronic component according to  claim 11 , wherein the external electrodes comprise:
 connection portions disposed on both surfaces of the capacitor body in a longitudinal direction and connected to the exposed portions of the internal electrodes; and   bent portions extending from the connection portions to a portion of a mounting surface of the capacitor body facing the one surface of the board.   
     
     
         13 . The electronic component according to  claim 11 , wherein the external electrodes further comprise:
 conductive layers; and   plating layers disposed on surfaces of the conductive layers.   
     
     
         14 . The electronic component according to  claim 13 , wherein the plating layers comprise:
 nickel plating layers disposed on the surfaces of the conductive layers; and   tin plating layers disposed on surfaces of the nickel plating layers.   
     
     
         15 . The electronic component according to  claim 11 , wherein the length of the multilayer capacitor is a dimension of the multilayer capacitor in a longitudinal direction,
 the plurality of internal electrodes are alternatively exposed from surfaces of the capacitor body in the longitudinal direction, and   the first and second electrode pads include inner edges facing each other in the longitudinal direction and opposing the outer edges in the longitudinal direction.   
     
     
         16 . A multilayer capacitor package, comprising:
 a packing part containing information, and including a housing and a multilayer capacitor disposed in the housing, internal electrodes of the multilayer capacitor disposed horizontally with respect to a bottom surface of the housing,   wherein the information indicates a distance Lp between outer edges of pads on aboard, on which the multilayer capacitor is to be mounted, and   Lp/Lc≤1.35, in which Lc is a length of the multilayer capacitor.   
     
     
         17 . A multilayer capacitor package, comprising:
 a packing part containing information, and including a housing part and a multilayer capacitor disposed in the housing, internal electrodes of the multilayer capacitor disposed vertically with respect to a bottom surface of the housing,   wherein the information indicates a distance Lp between outer edges of pads on aboard, on which the multilayer capacitor is to be mounted, and   Lp/Lc>1.35, in which Lc is a length of the multilayer capacitor.   
     
     
         18 . A multilayer capacitor package, comprising:
 a first packing part containing first information, and including a first housing and a first multilayer capacitor disposed in the first housing, internal electrodes of the first multilayer capacitor disposed horizontally with respect to a bottom surface of the first housing; and   a second packing part containing first information, and including a second housing and a second multilayer capacitor disposed in the second housing, internal electrodes of the second multilayer capacitor disposed vertically with respect to a bottom surface of the second housing,   wherein a size of the first multilayer capacitor is substantially the same as a size of the second multilayer capacitor,   the first information indicates a first distance Lp 1  between outer edges of pads on a board, on which the first multilayer capacitor is to be mounted,   Lp 1 /Lc≤R0, in which Lc is a length of each of the first and second multilayer capacitors and R0 is a predetermined value,   the second information indicates a second distance Lp 2  between outer edges of pads on a board, on which the second multilayer capacitor is to be mounted, and   Lp 2 /Lc>R0.   
     
     
         19 . The multilayer capacitor package of  claim 18 , wherein R0=1.35.