Aluminum plating film and method for producing aluminum plating film

Abstract

An aluminum plating film contains aluminum as a main component. The aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum.

1 . An aluminum plating film comprising aluminum as a main component,
 wherein the aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum.   
     
     
         2 . The aluminum plating film according to  claim 1 , wherein the aluminum plating film has an elongated sheet-like shape. 
     
     
         3 . The aluminum plating film according to  claim 1 , wherein the aluminum plating film forms a skeleton of a metal porous body, the skeleton having a three-dimensional network structure. 
     
     
         4 . The aluminum plating film according to  claim 3 , wherein the metal porous body has an elongated sheet-like shape. 
     
     
         5 . The aluminum plating film according to  claim 1 , wherein the aluminum plating film has a plurality of the intervening layers in the thickness direction of the aluminum plating film. 
     
     
         6 . The aluminum plating film according to  claim 1 , wherein the metal having a lower ionization tendency than aluminum is at least one selected from the group consisting of iron, zinc, zirconium, manganese, nickel, and copper. 
     
     
         7 . The aluminum plating film according to  claim 1 , wherein the aluminum plating film has a thickness of 10 μm or more and 1,000 μm or less. 
     
     
         8 . A method for producing the aluminum plating film according to  claim 1 , the method comprising:
 a first electrolytic treatment step of forming a pre-aluminum plating film by subjecting a substrate, at least a surface of the substrate being conductive, to an electrolytic treatment in a first electrolyte to electrodeposit aluminum on a surface of the substrate;   a replacement step of, after the first electrolytic treatment step, forming a replacement plating film by immersing the pre-aluminum plating film in a replacement solution that contains the first electrolyte and a metal having a lower ionization tendency than aluminum to replace a surface of the pre-aluminum plating film with the metal having a lower ionization tendency than aluminum; and   a second electrolytic treatment step of, after the replacement step, forming an aluminum plating film by subjecting the replacement plating film to an electrolytic treatment in a second electrolyte to electrodeposit aluminum on a surface of the replacement plating film,   wherein the first electrolyte and the second electrolyte are each a molten salt that contains at least aluminum chloride.   
     
     
         9 . The method for producing the aluminum plating film according to  claim 8 , wherein the substrate is a resin molded body having a skeleton with a three-dimensional network structure. 
     
     
         10 . The method for producing the aluminum plating film according to  claim 8 , comprising a removal step of removing the substrate after the second electrolytic treatment step.