Interconnect for on-body analyte monitoring device

Abstract

Disclosed herein are systems and methods for providing a compressible interconnect for allowing electrical communication between an electronics unit and an analyte sensor in an on-body analyte monitoring device. In other embodiments, systems and methods are provided for reducing the Z-height of an on-body analyte monitoring device by utilizing novel interconnects.

1 . An electronics unit for receiving one or more signals from an analyte sensor, the electronics unit comprising:
 a body having a top surface, an opposing bottom surface and a sidewall defined therebetween,   a processor and a circuit board disposed within the body of the electronics unit, and   an elongate interconnect comprising conductive material defining a body of the interconnect, the body having a first end secured to the circuit board and a second end engaged to the body of the electronics unit, and a length extending laterally from the sidewall of the body of the electronics unit.   
     
     
         2 . The electronics unit of  claim 1 , wherein the processor is an application specific integrated circuit (ASIC). 
     
     
         3 . The electronics unit of  claim 1 , wherein the conductive material defines a conductive area. 
     
     
         4 . The electronics unit of  claim 3 , wherein the conductive area contacts the circuit board disposed in the body of the electronics unit. 
     
     
         5 . The electronics unit of  claim 4 , wherein the conductive area establishes electrical communication between the elongate interconnect and the circuit board. 
     
     
         6 . The electronics unit of  claim 1 , wherein the elongate interconnect further comprises a contact plate disposed along a length of the interconnect body. configured to contact or engage the analyte sensor, and further wherein such contact establishes electrical communication between the interconnect and the analyte sensor. 
     
     
         8 . The electronics unit of  claim 1 , wherein the elongate interconnect is substantially U-shaped. 
     
     
         9 . The electronics unit of  claim 1 , wherein the elongate interconnect comprises material sufficiently flexible to collapse upon engagement with an analyte sensor. 
     
     
         10 . The electronics unit of  claim 1 , wherein the conductive material comprises gold. 
     
     
         11 . The electronics unit of  claim 1 , wherein the conductive material defines conductive traces, and further wherein the conductive traces are embedded in flexible material. 
     
     
         12 . The electronics unit of  claim 11 , wherein the flexible material is formed from a thermoplastic material. 
     
     
         13 . The electronics unit of  claim 12 , wherein the thermoplastic material includes polyimide. 
     
     
         14 . The electronics unit of  claim 13 , wherein the polyimide is Kapton®. 
     
     
         15 . The electronics unit of  claim 1 , wherein the conductive material includes a plurality of conductive cables, and further wherein the plurality of conductive cables is encapsulated within a flexible sheath. 
     
     
         16 . The electronics unit of  claim 1 , wherein the conductive material includes ribbon cables. 
     
     
         17 . The electronics unit of  claim 16 , wherein the ribbon cables are embedded in a flexible material. 
     
     
         18 . An on-body analyte monitoring device comprising:
 a mounting unit having a bottom surface adapted to attach to skin of a subject;   an analyte sensor configured to detect and monitor an analyte, the analyte sensor being disposed in the mounting unit;   an electronics unit for receiving one or more signals from the analyte sensor, the electronics unit comprising a body having a top surface, and opposing bottom surface and a sidewall defined therebetween, a processor and a PCB disposed within the body of the electronics unit; and   an elongate interconnect comprising conductive material defining a body of the interconnect, the body having a first end secured to the circuit board and a second end engaged to the body of the electronics unit, and a length extending laterally from the sidewall of the body of the electronics unit, wherein at least a section of the length directly contact the analyte sensor.   
     
     
         19 . The on-body analyte monitoring device of  claim 18 , wherein the analyte sensor comprises one or more electrodes. 
     
     
         20 . The on-body analyte monitoring device of  claim 19 , wherein the electrodes comprise gold. 
     
     
         21 - 101 . (canceled)