US2021066601A1PendingUtilityA1

Method for producing vapor deposition mask, and method for producing organic semiconductor element

Assignee: DAINIPPON PRINTING CO LTDPriority: Jan 12, 2012Filed: Nov 16, 2020Published: Mar 4, 2021
Est. expiryJan 12, 2032(~5.5 yrs left)· nominal 20-yr term from priority
H10K 71/421H10K 71/166C23C 14/042G03F 7/2063H10K 71/233C23F 1/12C23C 16/042C23F 1/02C23C 14/24G03F 7/32B05B 12/20G03F 7/20C23F 1/14H01L 51/56H01L 51/0011H01L 51/5012H01L 51/5221H01L 51/0021H10K 71/00H10K 50/82H10K 71/60H10K 50/11
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Claims

Abstract

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Claims

exact text as granted — not AI-modified
1 . A method for producing a vapor deposition mask that is formed by a resin mask having openings corresponding to a pattern to be produced by vapor deposition, comprising the step of:
 providing a resin layer;   forming the resin mask by forming the openings corresponding to a pattern to be produced by vapor deposition in the resin layer by emitting a laser.   
     
     
         2 . The method of producing a vapor deposition mask according to  claim 1 ,
 wherein a thickness of the resin mask is within a range not less than about 3 μm and less than about 10 μm.   
     
     
         3 . The method of producing a vapor deposition mask according to  claim 1 ,
 wherein a sectional shape of the resin mask is a shape including broadening toward a vapor deposition source side.   
     
     
         4 . The method of producing a vapor deposition mask according to  claim 1 ,
 wherein a thermal expansion coefficient of the resin mask is not more than about 16 ppm/° C.

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