Plating apparatus and plating method

Abstract

Provided is a plating apparatus for plating a substrate, which prevents deterioration of uniformity of plating film thickness caused by an oxide film created at an edge section of the substrate and/or an organic substance attached to the edge section of the substrate. The plating apparatus includes a plating bath for applying a voltage to the substrate set in a substrate holder to plate the substrate; and an edge section washing device that locally removes at least either of the organic substance and the oxide film present at the edge section of the substrate before the substrate is set in the substrate holder.

1 . A plating apparatus for plating a substrate, the plating apparatus comprising:
 an edge section washing device configured to locally remove at least either of an organic substance and an oxide film existing at an edge section of the substrate; and   a plating bath configured to contain a plating solution such that a voltage is applied between the substrate and an anode for plating while the substrate and the anode are immersed in the plating solution.   
     
     
         2 . The plating apparatus according to  claim 1 , wherein the edge section washing device includes an organic substance desorption device configured to locally desorb the organic substance existing at the edge section of the substrate, and the organic substance desorption device comprising a UV irradiation device configured to irradiate the edge section of the substrate that is rotating with an ultraviolet or a plasma emission device configured to emit a plasma to the edge section of the rotating substrate. 
     
     
         3 . The plating apparatus according to  claim 2 , further comprising an aligner configured to rotate the substrate to align the orientation of the substrate, wherein the organic substance desorption device is provided at the aligner. 
     
     
         4 . The plating apparatus according to  claim 2 , wherein the UV irradiation device or the plasma emission device is arranged at a position where the UV or plasma can be locally applied to the edge section of the substrate from above the substrate. 
     
     
         5 . The plating apparatus according to  claim 1 , wherein the edge section washing device includes an oxide film removal device configured to locally remove an oxide film existing at the edge section of the substrate, and
 the oxide film removal device includes a chemical liquid washing device including a chemical liquid nozzle for supplying a chemical liquid to the edge section of the substrate that is rotating.   
     
     
         6 . The plating apparatus according to  claim 5 , wherein the chemical liquid contains 3 wt % or more and 15 wt % or less of diluted sulfuric acid or 2 wt % or more and 20 wt % or less of citric acid. 
     
     
         7 . The plating apparatus according to  claim 5 , further comprising a spin rinse dryer configured to rotate and dry the substrate, and the oxide film removal device is provided at the spin rinse dryer. 
     
     
         8 . The plating apparatus according to  claim 5 , wherein the chemical liquid washing device is arranged at a position where the chemical liquid washing device is allowed to locally supply the chemical liquid to the edge section of the substrate from above the substrate. 
     
     
         9 . The plating apparatus according to  claim 1 , further comprising a sponge washing device configured to remove a particle existing at the edge section of the substrate. 
     
     
         10 . The plating apparatus according to  claim 1 , further comprising a sensor configured to irradiate with a light the edge section of the substrate from which at least either of the organic substance and the oxide film existing at the edge section has been locally removed and measure an intensity or absorbance of a reflected light. 
     
     
         11 . A plating method for plating a substrate, the plating method comprising:
 a removal step of locally removing at least either of an organic substance and an oxide film existing at an edge section of the substrate;   a step of holding the substrate by a substrate holder; and   a step of performing a plating process on the substrate held by the substrate holder.   
     
     
         12 . The plating method according to  claim 11 , further comprising:
 a step of forming a resist pattern on the substrate; and   an ashing step of ashing the resist pattern, wherein the removal step is performed after the ashing step.   
     
     
         13 . The plating method according to  claim 11 , wherein the removal step includes a step of locally radiating an ultraviolet or plasma to the edge section of the substrate. 
     
     
         14 . The plating method according to  claim 11 , wherein the removal step includes a step of locally supplying a chemical liquid to the edge section of the substrate. 
     
     
         15 . The plating method according to  claim 14 , wherein the chemical liquid contains 3 wt % or more and 15 wt % or less of diluted sulfuric acid or 2 wt % or more and 20 wt % or less of citric acid. 
     
     
         16 . The plating method according to  claim 11 , further comprising a step of bringing a sponge head into contact with the edge section of the substrate that is rotating to remove a particle. 
     
     
         17 . The plating method according to  claim 11 , wherein the removal step includes a step of locally removing the oxide film after locally desorbing the organic substance existing at the edge section of the substrate. 
     
     
         18 . The plating method according to  claim 11 , wherein the removal step includes a step of locally removing at least either of the organic substance and the oxide film existing within a range of 2 millimeters from a peripheral portion of the substrate toward the center of the substrate. 
     
     
         19 . The plating method according to  claim 11 , wherein the removal step includes a step of locally removing at least either of the organic substance and the oxide film existing in a region reaching a peripheral portion of the substrate adjacent to a region sealed by a seal member when the substrate is held by the substrate holder. 
     
     
         20 . The plating method according to  claim 11 , further comprising a step of irradiating with a light the edge section of the substrate from which at least either of the organic substance and the oxide film existing in the edge section has been removed and measuring an intensity or absorbance of a reflected light. 
     
     
         21 . A plating apparatus for plating a substrate, the plating apparatus comprising:
 a plating bath for performing plating by applying a voltage to the substrate held by a substrate holder; and   an edge section washing device configured to locally remove at least any one of an organic substance, an oxide film, and a particle existing at an edge section of the substrate.   
     
     
         22 . A plating method for plating a substrate, the plating method comprising:
 a removal step of locally removing at least any one of an organic substance, an oxide film, and a particle existing at an edge section of the substrate before the substrate is set in a substrate holder;   a step of holding the substrate by the substrate holder; and   a step of performing a plating process on the substrate held by the substrate holder.   
     
     
         23 . The plating apparatus according to  claim 1 , wherein the edge section washing device includes an organic substance desorption device configured to locally desorb the organic substance existing at the edge section of the substrate, the organic substance desorption device including a UV irradiation device configured to irradiating the edge section of the substrate with an ultraviolet or a plasma emission device configured to emit a plasma to the edge section of the substrate. 
     
     
         24 . The plating apparatus according to  claim 23 , wherein the edge section washing device includes a head unit configured to locally apply the ultraviolet or plasma to the edge section of the substrate, and an actuator configured to move the head unit in a horizontal direction. 
     
     
         25 . The plating apparatus according to  claim 24 , wherein the actuator comprises a first actuator configured to move the head unit in a first direction and a second actuator configured to move the head unit in a second direction orthogonal to the first direction. 
     
     
         26 . The plating apparatus according to  claim 24 , wherein
 the edge section washing device has a control unit configured to control the head unit and the actuator,   the actuator is configured to move the head unit along the edge section of the substrate, and   the control unit controls the head unit and the actuator such that the irradiation with the ultraviolet or plasma by the head unit and the movement of the head unit along the edge section of the substrate by the actuator take place simultaneously.   
     
     
         27 . The plating apparatus according to  claim 26 , wherein
 the edge section washing device has a pivot mechanism configured to cause the head unit to pivot, and   the control unit controls the head unit and the pivot mechanism such that irradiation with the ultraviolet or plasma by the head unit is stopped while the head unit is made to pivot by the pivot mechanism.   
     
     
         28 . The plating apparatus according to  claim 26 , wherein
 the edge section washing device has a rotation mechanism configured to rotate the substrate, and a control unit configured to control the head unit, the rotation mechanism, and the actuator, and   the control unit controls the head unit and the rotation mechanism such that irradiation with the ultraviolet or plasma by the head unit is stopped while the substrate is rotated by the rotation mechanism.   
     
     
         29 . The plating method according to  claim 11 , wherein the removal step includes a step of radiating an UV or plasma while moving a head unit radiating the UV or plasma along the edge section of the rectangular substrate. 
     
     
         30 . The plating method according to  claim 29 , wherein the removal step includes a step of moving the head unit in a horizontal direction to adjust a position of the head unit to the edge section of the rectangular substrate. 
     
     
         31 . The plating method according to  claim 29 , wherein the removal step has a step of causing the head unit to pivot while radiation of the ultraviolet or plasma is stopped after the ultraviolet or plasma has been radiated to one of the edge sections of the rectangular substrate. 
     
     
         32 . The plating method according to  claim 29 , wherein the removal step has a step of rotating the rectangular substrate while radiation of the ultraviolet or plasma is stopped after the UV or plasma has been radiated to one of the edge sections of the rectangular substrate.