US2021040252A1PendingUtilityA1
Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board
Est. expiryMay 11, 2035(~8.8 yrs left)· nominal 20-yr term from priority
C09J 2479/086B32B 27/30H05K 1/0393H05K 1/0353C08F 214/265B32B 27/28B32B 15/08B32B 7/12H05K 1/0313B32B 2457/08C09J 135/00B32B 2307/306B32B 2309/02C09J 2427/00H05K 3/022B32B 27/16C09J 2203/326C09J 2400/163C23F 1/00C08F 214/262C09J 5/06C09J 7/35B32B 27/00H05K 3/386C09J 129/10C09J 7/25H05K 2201/0154H05K 2201/015B32B 37/06B32B 38/0036H05K 3/06C09J 127/18H05K 2201/068
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Claims
Abstract
A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.
Claims
exact text as granted — not AI-modified1 . A material for a printed circuit board, which is a film consisting of a fluorinated resin layer, wherein the fluorinated resin layer comprises a composition comprising a fluorinated copolymer having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.
2 . The material according to claim 1 , wherein the fluorinated copolymer has at least a carbonyl group-containing group as the functional group, and the carbonyl group-containing group is at least one selected from the group consisting of a group having a carbonyl group between carbon atoms in a hydrocarbon group, a carbonate group, a carboxy group, a haloformyl group, an alkoxycarbonyl group and an acid anhydride residue.
3 . The material according to claim 1 , wherein the content of the functional group is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluorinated copolymer.
4 . A material for a printed circuit board, which is an adhesive film having a fluorinated resin layer directly laminated on at least one side of a heat resistant resin film, wherein
the fluorinated resin layer comprises a composition comprising a fluorinated copolymer having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and the linear expansion coefficient of the material for a printed circuit board at from 150 to 200° C. is within a range of from 0 to 25 ppm/° C.
5 . The material according to claim 4 , wherein the fluorinated copolymer has at least a carbonyl group-containing group as the functional group, and the carbonyl group-containing group is at least one selected from the group consisting of a group having a carbonyl group between carbon atoms in a hydrocarbon group, a carbonate group, a carboxy group, a haloformyl group, an alkoxycarbonyl group and an acid anhydride residue.
6 . The material according to claim 4 , wherein the content of the functional group is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluorinated copolymer.
7 . A metal laminate comprising an adhesive film having a fluorinated resin layer directly laminated on at least one side of a heat resistant resin film, and a metal layer directly laminated on the at least one fluorinated resin layer, wherein
the fluorinated resin layer comprises a composition comprising a fluorinated copolymer having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and has a melt flow rate of at most 15 g/10 min. measured at 372° C. under a load of 49 N, and the linear expansion coefficient of the adhesive film at from 150 to 200° C. is within a range of from 0 to 25 ppm/° C.
8 . The material according to claim 7 , wherein the fluorinated copolymer has at least a carbonyl group-containing group as the functional group, and the carbonyl group-containing group is at least one selected from the group consisting of a group having a carbonyl group between carbon atoms in a hydrocarbon group, a carbonate group, a carboxy group, a haloformyl group, an alkoxycarbonyl group and an acid anhydride residue.
9 . The material according to claim 7 , wherein the content of the functional group is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluorinated copolymer.Join the waitlist — get patent alerts
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