Polishing apparatus and retainer ring

Abstract

According to one embodiment, a polishing apparatus includes a polishing head having a retainer surrounding a substrate to be polished, and a polishing pad facing the polishing head. The retainer includes a first material and a second material. The first material contains at least one of aromatic polyamide, polyphenylene sulfide, polyetherimide, polyamideimide, polyetheretherketone, or polybenzimidazole. The second material contains a fluororesin.

What is claimed is: 
     
         1 . A polishing apparatus comprising:
 a polishing head having a retainer surrounding a substrate to be polished; and   a polishing pad facing the polishing head,   wherein the retainer includes a first material and a second material,   wherein the first material contains at least one of aromatic polyamide, polyphenylene sulfide, polyetherimide, polyamideimide, polyetheretherketone (PEEK), or polybenzimidazole, and   wherein the second material contains a fluororesin.   
     
     
         2 . The polishing apparatus according to  claim 1 ,
 wherein a weight percentage of the second material with respect to the first material is 1% to 10%.   
     
     
         3 . The polishing apparatus according to  claim 1 ,
 wherein the fluororesin of the second material includes at least one of polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane (PFA), a perfluoroethylene propene copolymer (FEP), an ethylene tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene-perfluorodioxole copolymer (TFE/PDD), or polyvinyl fluoride (PVF).   
     
     
         4 . The polishing apparatus according to  claim 3 ,
 wherein the first material contains PEEK and the fluororesin of the second material includes PTFE, and   wherein the weight of PTFE with respect to the weight of PEEK is 1% to 20%.   
     
     
         5 . The polishing apparatus according to  claim 1 ,
 wherein the retainer is a retainer ring.   
     
     
         6 . A retainer ring for use a polishing head for holding a substrate to be polished, the retainer ring comprising:
 a first material and a second material,   wherein the first material contains at least one of aromatic polyamide, polyphenylene sulfide, polyetherimide, polyamideimide, polyetheretherketone (PEEK), or polybenzimidazole, and   wherein the second material contains a fluororesin.   
     
     
         7 . The retainer ring according to  claim 6 ,
 wherein a weight percentage of the second material with respect to the first material is 1% to 10%.   
     
     
         8 . The retainer ring according to  claim 6 ,
 wherein the fluororesin includes at least one of polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane (PFA), a perfluoroethylene propene copolymer (FEP), an ethylene tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), tetrafluoroethylene-perfluorodioxole copolymer (TFE/PDD), or polyvinyl fluoride (PVF).   
     
     
         9 . The retainer ring according to  claim 8 ,
 wherein the first material contains PEEK and the fluororesin of the second material includes PTFE, and   wherein the weight of PTFE with respect to the weight of PEEK is 1% to 20%.   
     
     
         10 . A polishing head comprising the retainer ring of  claim 6 . 
     
     
         11 . A polishing head comprising the retainer ring of  claim 7 .