Multilayer ceramic electronic device and component mounting substrate

Abstract

A multilayer ceramic electronic device includes a ceramic main body and a pair of external electrodes respectively covering a pair of end surfaces of the ceramic main body, wherein the ceramic main body includes a laminated body including a plurality of internal electrodes laminated vertically therein, and a pair of side margin parts respectively covering a pair of side surfaces of the laminated body, and wherein a distance between a bottom surface of the ceramic main body and the bottommost internal electrode is greater than a distance between the top surface of the ceramic main body and the topmost internal electrode.

What is claimed is: 
     
         1 . A multilayer ceramic electronic device, comprising:
 a ceramic main body having a first main surface facing a first direction, a second main surface facing a direction opposite to the first direction, a pair of side surfaces respectively facing a second direction that is perpendicular to the first direction and a direction opposite to the second direction, and a pair of end surfaces respectively facing a third direction that is perpendicular to the first and second directions and a direction opposite to the third direction; and   a pair of external electrodes respectively covering the pair of end surfaces, the pair of external electrodes respectively extending from the end surfaces to the second main surface,   wherein the ceramic main body includes:
 a laminated body having a first cover part forming the first main surface, a second cover part forming the second main surface, and a plurality of internal electrodes laminated in the first direction, disposed between the first cover part and the second cover part; and 
 a pair of side margin parts respectively covering a pair of side surfaces of the laminated body that respectively face the second direction and the direction opposite to the second direction, the pair of side margin parts forming the pair of side surfaces of the ceramic main body, and 
   wherein a distance, along the first direction, between the second main surface and the internal electrode that is the closest to the second main surface among the plurality of the internal electrodes is greater than a distance, along the first direction, between the first main surface and the internal electrode that is the closest to the first main surface among the plurality of the internal electrodes.   
     
     
         2 . The multilayer ceramic electronic device according to  claim 1 ,
 wherein in the ceramic main body, each of ridge parts that connect the second main surface to the pair of the side surfaces and the pair of the end surfaces of the ceramic main body is chamfered, and   wherein said distance, along the first direction, between the second main surface and the internal electrode that is the closest to the second main surface among the plurality of the internal electrodes is equal to or greater than 2.5 times as large as a dimension, along the first direction, of chamfered parts of the ridge parts.   
     
     
         3 . A multilayer ceramic electronic device, comprising:
 a ceramic main body having a first main surface facing a first direction, a second main surface facing a direction opposite to the first direction, a pair of side surfaces respectively facing a second direction that is perpendicular to the first direction and a direction opposite to the second direction, and a pair of end surfaces respectively facing a third direction that is perpendicular to the first and second directions and a direction opposite to the third direction, the ceramic main body including a laminated body and a pair of side margin parts; and   a pair of external electrodes respectively covering the pair of end surfaces, the pair of external electrodes respectively extending from the end surfaces to the second main surface,   wherein the laminated body of the ceramic main body includes:
 a first cover part forming the first main surface; 
 a second cover part forming the second main surface; 
 a plurality of first internal electrodes; and 
 a plurality of second internal electrodes, 
   wherein the plurality of first internal electrodes are laminated in the first direction, disposed between the first cover part and the second cover part, and in a plan view as seen from the direction opposite to the first direction, each of overlap areas between the plurality of first internal electrodes has a same shape and same dimensions,   wherein the plurality of second internal electrodes are laminated in the first direction, disposed between the plurality of first internal electrodes and the second cover part, and in said plan view, along at least one of the second and third directions, each of overlap areas between the plurality of second internal electrodes is positioned inside said overlap areas between the plurality of first electrodes, and   wherein said pair of side margin parts of the laminated body respectively cover a pair of side surfaces of the laminated body that respectively face the second direction and the direction opposite to the second direction, the pair of side margin parts forming the pair of side surfaces of the ceramic main body.   
     
     
         4 . The multilayer ceramic electronic device according to  claim 3 ,
 wherein lateral edges, along the second direction, of the plurality of first internal electrodes are positioned on the pair of side surfaces of the laminated body, and   wherein lateral edges, along the second direction, of the plurality of second internal electrodes are positioned on inner sides of the pair of side surfaces of the laminated body.   
     
     
         5 . The multilayer ceramic electronic device according to  claim 4 , wherein in said plan view, a dimension of the overlap areas between the plurality of second internal electrodes along the third direction is smaller than a dimension of the overlap areas between the plurality of first electrodes along the third direction. 
     
     
         6 . The multilayer ceramic electronic device according to  claim 4 , wherein the pair of external electrodes respectively extend from the pair of end surfaces to the pair of side surfaces of the ceramic main body. 
     
     
         7 . The multilayer ceramic electronic device according to  claim 3 ,
 wherein lateral edges, along the second direction, of the plurality of first internal electrodes and lateral edges, along the second direction, of the plurality of second internal electrodes are both positioned on the pair of side surfaces of the laminated body, and   wherein in said plan view, a dimension of the overlap areas between the plurality of second internal electrodes along the third direction is smaller than a dimension of the overlap areas between the plurality of first electrodes along the third direction.   
     
     
         8 . The multilayer ceramic electronic device according to  claim 7 , wherein the pair of external electrodes do not extend from the end surfaces to the pair of side surfaces. 
     
     
         9 . The multilayer ceramic electronic device according to  claim 3 , wherein a distance, along the first direction, between the second main surface and the first internal electrode that is the closest to the second main surface among the plurality of the first internal electrodes is greater than a distance, along the first direction, between the first main surface and the first internal electrode that is the closest to the first main surface among the plurality of the first internal electrodes. 
     
     
         10 . A component mount substrate, comprising:
 the multilayer ceramic electronic device as set forth in  claim 1 ;   a circuit substrate having a mounting surface that faces the second main surface of the multilayer ceramic electronic device and a pair of electrodes pads on the mounting surface; and   solders that comment the pair of the external electrodes of the multilayer ceramic electronic device to the pair of electrode pads, respectively.   
     
     
         11 . A component mount substrate, comprising:
 the multilayer ceramic electronic device as set forth in  claim 3 ;   a circuit substrate having a mounting surface that faces the second main surface of the multilayer ceramic electronic device and a pair of electrodes pads on the mounting surface; and   solders that comment the pair of the external electrodes of the multilayer ceramic electronic device to the pair of electrode pads, respectively.