US2021033234A1PendingUtilityA1
Air-based cooling for data center rack
Assignee: ZONIT STRUCTURED SOLUTIONS LLCPriority: Mar 14, 2007Filed: May 14, 2020Published: Feb 4, 2021
Est. expiryMar 14, 2027(~0.6 yrs left)· nominal 20-yr term from priority
H05K 7/20745F16L 9/19H05K 7/20836F16L 37/38F28D 7/10F16K 11/0785F16L 37/46
71
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Claims
Abstract
A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A conduit apparatus for use in a closed-loop, air-based coolant circuit including a delivery passageway for delivery of coolant air to a heat exchange site separate from said conduit apparatus and a return flow passageway for said coolant air, said conduit apparatus comprising, comprising:
an inner conduit defining said delivery passageway for the coolant air; an outer conduit encompassing the inner conduit; and at least one rib for maintaining a spacing between an outer surface of said inner conduit and an inner surface of said outer conduit, said spacing accommodating said return flow passageway for the coolant air.
2 . The conduit apparatus as set forth in claim 1 , wherein said outer conduit defines a return passageway for warmed coolant air.
3 . The conduit apparatus as set forth in claim 1 , further comprising a conductive trace embedded in said outer conduitJoin the waitlist — get patent alerts
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