US2021031310A1PendingUtilityA1
Solder material
Est. expiryApr 7, 2037(~10.7 yrs left)· nominal 20-yr term from priority
B23K 35/262B23K 2103/08C22C 13/00B23K 35/26
49
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Claims
Abstract
A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.
Claims
exact text as granted — not AI-modified1 . A solder material including 2.5 to 3.3 wt % Ag, 0.3 to 0.5 wt % Cu, 5.5 to 6.4 wt % In, and 0.5 to 1A wt % Sb, a remainder thereof being unavoidable impurities and Sn, wherein the solder material does not substantively include Bi.
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