Plating diaphragm, plating method, and plating apparatus

Abstract

Provided is a plating diaphragm used for a plating method including disposing the plating diaphragm between an anode and a substrate that is a cathode, applying a voltage between the anode and the substrate, in a state in which a surface of the substrate is in contact with the plating diaphragm, to reduce metal ions contained in the plating diaphragm, and depositing a metal derived from the metal ions on the surface of the substrate, to form a metal film on the surface of the substrate, the plating diaphragm containing a base made of a polyolefin porous membrane, in a case in which pure water is dropped on a surface of the plating diaphragm, a contact angle θ between a droplet of the pure water and the surface of the plating diaphragm after one second has passed since landing of the droplet of the pure water on the surface is from 0° to 90°, and a tensile breaking strength is from 11 MPa to 300 MPa.

What is claimed is: 
     
         1 . A plating diaphragm used for a plating method comprising disposing the plating diaphragm between an anode and a substrate that is a cathode, applying a voltage between the anode and the substrate, in a state in which a surface of the substrate is in contact with the plating diaphragm, to reduce metal ions contained in the plating diaphragm, and depositing a metal derived from the metal ions on the surface of the substrate, to form a metal film on the surface of the substrate, the plating diaphragm comprising:
 a base made of a polyolefin porous membrane,   wherein, in a case in which pure water is dropped on a surface of the plating diaphragm, a contact angle θ between a droplet of the pure water and the surface of the plating diaphragm after one second has passed since landing of the droplet of the pure water on the surface is from 0° to 90°, and a tensile breaking strength is from 11 MPa to 300 MPa.   
     
     
         2 . The plating diaphragm according to  claim 1 , wherein an average pore size of the plating diaphragm is from 5 nm to 300 nm. 
     
     
         3 . The plating diaphragm according to  claim 1 , wherein a thickness of the plating diaphragm is from 8 μm to 200 μm. 
     
     
         4 . The plating diaphragm according to  claim 1 , wherein the base has a hydrophilic material on at least a portion of a main surface, a pore inner surface, or a combination thereof. 
     
     
         5 . The plating diaphragm according to  claim 4 , wherein the hydrophilic material has at least one selected from the group consisting of a hydroxy group, a carbonyl group, a carboxy group, a formyl group, a sulfo group, a sulfonyl group, a thiol group, an amino group, a nitrile group, a nitro group, a pyrrolidone ring group, an ether bond and an amide bond. 
     
     
         6 . The plating diaphragm according to  claim 4 , wherein the hydrophilic material includes an olefin/vinyl alcohol resin. 
     
     
         7 . The plating diaphragm according to  claim 1 , wherein the metal is at least one selected from the group consisting of nickel, zinc, copper, chromium, tin, silver, gold and lead. 
     
     
         8 . A plating method comprising:
 disposing a plating diaphragm between an anode and a substrate that is a cathode;   applying a voltage between the anode and the substrate, in a state in which a surface of the substrate is in contact with the plating diaphragm, to reduce metal ions contained in the plating diaphragm; and   depositing a metal derived from the metal ions on the surface of the substrate, to form a metal film on the surface of the substrate,   wherein the plating diaphragm comprises a base made of a polyolefin porous membrane, and   wherein, in a case in which pure water is dropped on a surface of the plating diaphragm, a contact angle θ between a droplet of the pure water and the surface of the plating diaphragm after one second has passed since landing of the droplet of the pure water on the surface is from 0° to 90°, and a tensile breaking strength of the plating diaphragm is from 11 MPa to 300 MPa.   
     
     
         9 . A plating apparatus comprising:
 an anode;   a plating diaphragm that is disposed between the anode and a substrate, which is a cathode, and that contains metal ions; and   a power supply that applies a voltage between the anode and the substrate,   a metal that is derived from the metal ions being deposited on a surface of the substrate in contact with the plating diaphragm, to form a metal film on the surface of the substrate,   wherein the plating diaphragm comprises a base made of a polyolefin porous membrane, and in a case in which pure water is dropped on a surface of the plating diaphragm, a contact angle θ between a droplet of the pure water and the surface of the plating diaphragm after one second has passed since landing of the droplet of the pure water on the surface is from 0° to 90°, and a tensile breaking strength of the plating diaphragm is from 11 MPa to 300 MPa.