Integrated photosensitive module, photosensitive assembly, camera module and preparation method therefor

Abstract

Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

1 - 48 . (canceled) 
     
     
         49 . A photosensitive module suitable for a camera module, comprising:
 a photosensitive element, wherein the photosensitive element has a photosensitive region and a non-photosensitive region;   a light transmitting element, wherein the light transmitting element is provided on a photosensitive path of the photosensitive element; and   an isolation adhesive layer, wherein the isolation adhesive layer is provided in the non-photosensitive region and supports the light transmitting element, wherein the isolation adhesive layer is formed by using photolithography technology.   
     
     
         50 . The photosensitive module according to  claim 49 , wherein the isolation adhesive layer closely surrounds the photosensitive region, forming an enclosed space with the light transmitting element and the photosensitive element. 
     
     
         51 . The photosensitive module according to  claim 49 , wherein the non-photosensitive region has an electrical connection region, and the isolation adhesive layer is provided on the non-photosensitive region in a manner to be separated from the electrical connection region. 
     
     
         52 . The photosensitive module according to  claim 49 , wherein the isolation adhesive layer has an inner side surface, wherein the inner side surface is spaced apart from an outer edge of the photosensitive region by a preset distance to form an overflow glue space for accommodating overflow glue. 
     
     
         53 . The photosensitive module according to  claim 49 , wherein the isolation adhesive layer has an inner side surface, wherein the inner side surface is perpendicular to the photosensitive region. 
     
     
         54 . A photosensitive assembly suitable for a camera module, comprising:
 a photosensitive module, wherein the photosensitive module includes a photosensitive element, an isolation adhesive layer and a light transmitting element, wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the isolation adhesive layer is provided on the non-photosensitive region, and supports the light transmitting element corresponding to the photosensitive region, wherein the isolation adhesive layer is formed using photolithography technology;   a circuit layer, wherein the circuit layer is electrically connected to the photosensitive element; and   a molding body, wherein the molding body encapsulates the photosensitive module and the circuit layer, wherein an exposed side of the light transmitting element is exposed to the outside for light to enter.   
     
     
         55 . The photosensitive assembly according to  claim 49 , wherein the circuit layer is provided on a bottom side of the photosensitive module, and the photosensitive element is electrically connected and attached to the circuit layer, wherein the molding body is molded on the circuit layer, and has a light passing hole corresponding to the photosensitive region. 
     
     
         56 . The photosensitive assembly according to  claim 55 , wherein the light transmitting element is provided in the light passing hole, the molding body is wrapped around the peripheral side surface of the light transmitting element, and the exposed side of the light transmitting element is exposed with respect to a top surface of the molding body. 
     
     
         57 . The photosensitive assembly according to  claim 56 , wherein the peripheral side surface of the light transmitting element is roughened. 
     
     
         58 . The photosensitive assembly according to  claim 56 , wherein the peripheral side surface of the light transmitting element is inclined, and the light passing hole formed by the molding body wrapping around the peripheral side surface of the light transmitting element has a bottom-up increased shape. 
     
     
         59 . The photosensitive assembly according to  claim 49 , wherein the circuit layer is provided on a light incident side of the photosensitive module, and the molding body supports the circuit layer, the circuit layer has a light passing hole, wherein the light passing hole corresponds to the photosensitive region of the photosensitive element. 
     
     
         60 . The photosensitive assembly of  claim 59 , wherein the circuit layer is implemented as an extended wiring layer formed by a re-wiring process. 
     
     
         61 . The photosensitive assembly according to  claim 59 , further including at least one conductive member, wherein the conductive member extends upward from the photosensitive element to the circuit layer on the light incident side, electrically connecting the circuit layer and the photosensitive element. 
     
     
         62 . The photosensitive assembly according to  claim 61 , further including at least one electronic component, wherein an electrical connection surface of the electronic component is on the light incident side, is exposed with respect to the molding body, and is electrically connected to the circuit layer, wherein the molding body encapsulates and supports the electronic component. 
     
     
         63 . The photosensitive assembly according to  claim 62 , wherein the molding body includes a first molding body and a second molding body, wherein the first molding body encapsulates the photosensitive module and the conductive member, the light transmitting element and the conductive member are exposed with respect to the molding body on the light incident side, to form a molding single body, wherein the second molding body encapsulates the electronic component and the molding single body, the electrical connection surface of the electronic component is exposed with respect to the second molding body on the light incident side. 
     
     
         64 . The photosensitive assembly according to  claim 59 , further including a second extended wiring layer, wherein the extended wiring layer is provided on the bottom surface of the molding body, and the second extended wiring layer is electrically connect the circuit board. 
     
     
         65 . A method for manufacturing a photosensitive component, including:
 (a) forming a plurality of isolation adhesive layers at a preset position of a chip wafer by a photolithography process, wherein the chip wafer has a plurality of photosensitive elements arranged in an array, and each photosensitive element is provided with the isolation adhesive layer in its non-photosensitive region;   (b) covering at least one light transmitting element on at least one of the isolation adhesive layers; and   (c) cutting the chip wafer to form a plurality of photosensitive modules.   
     
     
         66 . The manufacturing method according to  claim 65 , wherein the step (a) further includes the steps of:
 (a.1) coating photosensitive material on the photosensitive surface of the chip wafer;   (a.2) selectively exposing the photosensitive material; and   (a.3) using a developer to remove the photosensitive material in the preset region, exposing each photosensitive region, and forming the isolation adhesive layer in each non-photosensitive region.   
     
     
         67 . The manufacturing method according to  claim 65 , further including the steps of:
 (D1) electrically connecting and arranging a plurality of the photosensitive modules on a circuit board jointed panel;   (E1) forming a molding body on the circuit board jointed panel through a molding process to encapsulate the photosensitive module and the circuit board jointed panel so as to form a photosensitive assembly jointed panel, wherein the molding body has a plurality of light passing holes corresponding to the photosensitive region of the photosensitive module; and   (F1) cutting the photosensitive assembly jointed panel to form a plurality of photosensitive assemblies.   
     
     
         68 . The manufacturing method according to  claim 65 , further including the steps of:
 (D2) conductively mounting at least one conductive member on the non-photosensitive region of the photosensitive element;   (E2) arranging the photosensitive modules on a substrate in an array;   (F2) forming a molding body on the substrate through a molding process to encapsulate the photosensitive module and the conductive member;   (G) mounting a circuit layer on the surface of the molding body on a light incident side, wherein the circuit layer is conductively connected to the conductive member, wherein the circuit layer has a plurality of light passing holes corresponding to the photosensitive paths of the photosensitive element, to form a photosensitive assembly jointed panel; and   (H) cutting the photosensitive assembly jointed panel to form a plurality of photosensitive assemblies.