Polishing composition and polishing method

Abstract

The present invention provides a solution for preventing the settling of an abrasive while maintaining the polishing performance. In addition, the present invention provides a solution for improving the redispersibility of an abrasive while maintaining the polishing performance. The present invention relates to a polishing composition for use in polishing a semiconductor substrate, the polishing composition containing an abrasive, a layered compound, and a dispersion medium.

1 .- 5 . (canceled) 
     
     
         6 . A polishing method comprising:
 storing a polishing composition for use in polishing a semiconductor substrate, the polishing composition comprising an abrasive, a layered compound, and a dispersion medium, the storing being at a temperature of 10° C. or more for 20 days or more after production; and   polishing a semiconductor substrate using the polishing composition after storage.   
     
     
         7 . The polishing method of  claim 6 , wherein the layered compound is a layered silicate compound. 
     
     
         8 . The polishing method of  claim 6 , wherein an average secondary particle diameter of the abrasive is 1.8 μm or less. 
     
     
         9 . The polishing method of  claim 6 , wherein the semiconductor substrate is a compound semiconductor substrate.