Electronic device module and method of manufacturing the same

Abstract

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component, a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves, and a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall. The shielding wall includes a first wall and a second wall spaced apart from each other, and the shielding layer is partially formed on opposing surfaces of the first wall and the second wall.

What is claimed is: 
     
         1 . An electronic device module comprising:
 a substrate;   at least one first component and at least one second component disposed on one surface of the substrate;   a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component;   a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves; and   a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall,   wherein the shielding wall comprises a first wall and a second wall spaced apart from each other, and a gap between the first wall and the second wall is formed as an empty space.   
     
     
         2 . The electronic device module of  claim 1 , wherein the substrate comprises a ground layer exposed to a side surface of the substrate, and wherein the shielding layer is extended to the side surface of the substrate and connected to the ground layer. 
     
     
         3 . The electronic device module of  claim 2 , wherein the substrate comprises connection electrodes on the one surface, and the shielding wall is disposed on an upper portion of the connection electrodes. 
     
     
         4 . The electronic device module of  claim 3 , wherein the substrate further comprises a ground via connecting the connection electrodes and the ground layer. 
     
     
         5 . The electronic device module of  claim 4 , wherein the ground via comprises a plurality of ground vias disposed along the shielding wall in parallel. 
     
     
         6 . The electronic device module of  claim 3 , further comprising a connection conductor disposed between the connection electrodes and the shielding wall. 
     
     
         7 . The electronic device module of  claim 3 , wherein both the first wall and the second wall are connected to one of the connection electrodes. 
     
     
         8 . The electronic device module of  claim 1 , wherein the first wall and the second wall are spaced apart from each other by a distance ranging from 20 μm to 300 μm. 
     
     
         9 . The electronic device module of  claim 1 , wherein thicknesses of the first wall and the second wall are greater than a thickness of the shielding layer. 
     
     
         10 . The electronic device module of  claim 1 , wherein the shielding layer comprises a material different from a material of the shielding wall. 
     
     
         11 . The electronic device module of  claim 1 , wherein the shielding layer is partially formed on opposing surfaces of the first wall and the second wall. 
     
     
         12 . The electronic device module of  claim 1 , wherein the first wall is integrated with the first sealing portion, and the second wall is integrated with the second sealing portion. 
     
     
         13 . The electronic device module of  claim 1 , further comprising an interface between the shielding layer and the shielding wall.