Copper-iron alloy electroplating solution and electroplating method using the same

Abstract

Provided are a copper-iron alloy electroplating solution containing divalent copper ions, trivalent iron ions, and an organic compound having a carboxy group, and a technique for producing a copper-iron alloy through a method other than a melting method by an electroplating method using the copper-iron alloy electroplating solution.

1 . A copper-iron alloy electroplating solution, comprising divalent copper ions, trivalent iron ions, and an organic compound having a carboxy group. 
     
     
         2 . The copper-iron alloy electroplating solution according to  claim 1 , wherein a source of the divalent copper ions is cupric sulfate or cupric chloride. 
     
     
         3 . The copper-iron alloy electroplating solution according to  claim 1 , wherein a source of the trivalent iron ions is ferric sulfate or ferric chloride. 
     
     
         4 . The copper-iron alloy electroplating solution according to  claim 1 , wherein the organic compound having a carboxy group is ethylenediaminetetraacetic acid, sodium gluconate, or citric acid. 
     
     
         5 . The copper-iron alloy electroplating solution according to  claim 1 , wherein the solution has a pH in a range of from 4 to 11. 
     
     
         6 . The copper-iron alloy electroplating solution according to  claim 1 , wherein a molar ratio of copper ions/iron ions is in a range of from 0.1 to 0.8. 
     
     
         7 . A copper-iron alloy electroplating method, comprising electroplating a material to be plated in the copper-iron alloy electroplating solution according to  claim 1 , thereby forming a copper-iron alloy film on the material to be plated. 
     
     
         8 . A copper-iron alloy film obtained by the copper-iron alloy electroplating method according to  claim 7 .