Conductive trace interconnection tape

Abstract

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Having thus described various embodiments of the technology, what is claimed as new and desired to be protected by Letters Patent includes the following: 
     
         1 . A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate, the conductive trace interconnect tape comprising:
 a top insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape;   an electrically conductive layer positioned underneath the top insulating layer, the electrically conductive layer formed from electrically conductive material and including electrical component pads; and   a bottom insulating layer positioned underneath the electrically conductive layer, the bottom insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.   
     
     
         2 . The conductive trace interconnect tape of  claim 1 , further comprising a top adhesive layer that bonds a lower surface of the top insulating layer to an upper surface of the electrically conductive layer and an upper surface of the bottom insulating layer. 
     
     
         3 . The conductive trace interconnect tape of  claim 1 , further comprising a bottom adhesive layer that bonds a lower surface of the bottom insulating layer to a surface of the printed circuit board or flexible circuit substrate. 
     
     
         4 . The conductive trace interconnect tape of  claim 1 , further comprising a middle adhesive layer that bonds a lower surface of the electrically conductive layer to an upper surface of the bottom insulating layer. 
     
     
         5 . (previously canceled) 
     
     
         6 . A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate, the conductive trace interconnect tape comprising:
 a top insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape;   an electrically conductive layer positioned underneath the top insulating layer, the electrically conductive layer formed from electrically conductive material and including electrical interconnect traces, electrical component pads, and electrically conductive planar portions;   a bottom insulating layer positioned underneath the electrically conductive layer, the bottom insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate;   a top adhesive layer that bonds a lower surface of the top insulating layer to an upper surface of the electrically conductive layer and an upper surface of the bottom insulating layer;   a middle adhesive layer that bonds a lower surface of the electrically conductive layer to an upper surface of the bottom insulating layer; and   a bottom adhesive layer that bonds a lower surface of the bottom insulating layer to a surface of the printed circuit board or flexible circuit substrate.   
     
     
         7 . (previously canceled) 
     
     
         8 . A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate, the conductive trace interconnect tape comprising:
 a top insulating layer of elongated rectangular shape, the top insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape;   an electrically conductive layer positioned underneath the top insulating layer, the electrically conductive layer formed from electrically conductive material and including a plurality of spaced-apart electrical interconnect traces; and   a bottom insulating layer of elongated rectangular shape and positioned underneath the electrically conductive layer, the bottom insulating layer formed from electrically insulating material and configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate,   wherein the top insulating layer and the bottom insulating layer each have a first length and each of the electrical interconnect traces has a second length greater than the first length and the electrically conductive layer is positioned between the top insulating layer and the bottom insulating layer such that a first portion of each electrical interconnect trace extends from one end of the top insulating layer and the bottom insulating layer and a second portion of each electrical interconnect trace extends from an opposing end of the top insulating layer and the bottom insulating layer.   
     
     
         9 . The conductive trace interconnect tape of  claim 8 , further comprising a top adhesive layer that bonds a lower surface of the top insulating layer to an upper surface of the electrically conductive layer and an upper surface of the bottom insulating layer. 
     
     
         10 . The conductive trace interconnect tape of  claim 8 , further comprising a bottom adhesive layer that bonds a lower surface of the bottom insulating layer to a surface of the printed circuit board or flexible circuit substrate. 
     
     
         11 . The conductive trace interconnect tape of  claim 8 , further comprising a middle adhesive layer that bonds a lower surface of the electrically conductive layer to an upper surface of the bottom insulating layer. 
     
     
         12 . (previously canceled) 
     
     
         13 . The conductive trace interconnect tape of  claim 1 , wherein the electrically conductive layer further includes electrically conductive planar portions.