US2020365832A1PendingUtilityA1

Package structure of organic light emitting component and method for manufacturing the same

Assignee: SHENZHEN CHINA STAR OPTOELECTPriority: Dec 26, 2017Filed: Feb 24, 2018Published: Nov 19, 2020
Est. expiryDec 26, 2037(~11.4 yrs left)· nominal 20-yr term from priority
Inventors:Hui Huang
H10K 59/879H10K 59/873H10K 50/858H10K 59/40H01L 51/5246H01L 2251/303H01L 51/5253H01L 51/56H01L 51/5275H01L 27/32H01L 2251/5369H10K 2102/311H10K 50/8426H10K 2102/351H10K 59/00H10K 77/111H10K 2102/00H10K 50/844H10K 71/00H10K 2102/331
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Claims

Abstract

The present disclosure provides a package structure of an organic light emitting component and a method for manufacturing the same. The package structure includes: a substrate, provided with light emitting pixels; a first barrier layer, arranged on the substrate; a nanoparticle layer, arranged on a portion of the first barrier layer corresponding to a location of the light emitting pixels, wherein the nanoparticle layer is configured to extract light from the light emitting pixels; a buffer layer, arranged on another portion of the first barrier layer where the nanoparticle layer is not set; a second barrier layer, arranged on the nanoparticle layer and the buffer layer. The implementation of the present disclosure allows the light extraction to be applied only on the light emitting pixels. Therefore, it can avoid the waste of material and reduce production cost.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for manufacturing a package structure of an organic light emitting component, comprising:
 preparing a substrate provided with a plurality of light emitting pixels;   applying a first barrier layer on the substrate;   providing, by a spraying or evaporation process, a nanoparticle layer on portions of the first barrier layer corresponding to each of the light emitting pixels, wherein the nanoparticle layer is configured to extract light from the light emitting pixels;   uniformly disposing a buffer layer on areas of the first barrier layer not covered by the nanoparticle layer; and   uniformly disposing a second barrier layer on the buffer layer and the nanoparticle layer;   wherein, the thickness of the buffer layer is greater than or equal to the sum of a-the thickness of the nanoparticle layer and the thickness of the first barrier layer.   
     
     
         2 . The method of  claim 1 , wherein the nanoparticle layer comprises metal oxide material. 
     
     
         3 . The method of  claim 2 , wherein the nanoparticle layer further comprises one of magnesium oxide, calcium oxide and zirconium oxide. 
     
     
         4 . The method of  claim 1 , wherein the buffer layer is formed by coating or inkjet printing. 
     
     
         5 . A package structure of an organic light emitting component, comprising:
 a substrate, provided with a plurality of light emitting pixels;   a first barrier layer, arranged on the substrate;   a nanoparticle layer, arranged on portions of the first barrier layer corresponding to each of the light emitting pixels, wherein the nanoparticle layer is configured to extract light from the light emitting pixels;   a buffer layer, arranged on areas of the first barrier layer not covered by the nanoparticle layer; and   a second barrier layer, arranged on the nanoparticle layer and the buffer layer.   
     
     
         6 . The package structure of  claim 5 , wherein the thickness of the buffer layer is greater than or equal to the sum of the thickness of the nanoparticle layer and the thickness of a first barrier layer. 
     
     
         7 . The package structure of  claim 5 , wherein the nanoparticle layer comprises metal oxide material. 
     
     
         8 . The package structure of  claim 7 , wherein the nanoparticle layer further comprises one of magnesium oxide, calcium oxide and zirconium oxide. 
     
     
         9 . A method for manufacturing a package structure of an organic light emitting component, comprising:
 preparing a substrate provided with a plurality of light emitting pixels;   applying a first barrier layer on the substrate;   providing a nanoparticle layer on portions of the first barrier layer corresponding to each of the light emitting pixels, wherein the nanoparticle layer is configured to extract light from the light emitting pixels;   uniformly disposing a buffer layer on areas of the first barrier layer not covered by the nanoparticle layer; and   uniformly disposing a second barrier layer on the buffer layer and the nanoparticle layer.   
     
     
         10 . The method of  claim 9 , wherein, the thickness of the buffer layer is greater than or equal to the sum of the thickness of the nanoparticle layer and the thickness of the first barrier layer. 
     
     
         11 . The method of  claim 9 , wherein the nanoparticle layer is formed by evaporation or spray. 
     
     
         12 . The method of  claim 9 , wherein the nanoparticle layer comprises metal oxide material. 
     
     
         13 . The method of  claim 12 , wherein the nanoparticle layer further comprises one of magnesium oxide, calcium oxide and zirconium oxide. 
     
     
         14 . The method of  claim 9 , wherein the buffer layer is formed by coating or inkjet printing.

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