Optoelectronic component and method of operating an optoelectronic component

Abstract

An optoelectronic component includes a first optoelectronic semiconductor chip configured to emit infrared light; a second optoelectronic semiconductor chip configured to emit visible light; a reflector body including a top side and an underside, wherein the reflector body includes a cavity opened toward the top side, a wall of the cavity constitutes a reflector, and the first optoelectronic semiconductor chip is arranged at a bottom of the cavity, an optical lens arranged at the top side of the reflector body, and an optical waveguide extending through the reflector body from the underside to the top side, wherein the reflector body is arranged above the second optoelectronic semiconductor chip such that light emitted by the second optoelectronic semiconductor chip passes into the optical waveguide at the underside of the reflector body, and light may emerge from the optical waveguide at the top side of the reflector body.

1 . An optoelectronic component comprising:
 a first optoelectronic semiconductor chip configured to emit light comprising a wavelength from the infrared spectral range;   a second optoelectronic semiconductor chip configured to emit light comprising a wavelength from the visible spectral range;   a reflector body comprising a top side and an underside,   wherein the reflector body comprises a cavity opened toward the top side,   a wall of the cavity constitutes a reflector, and the first optoelectronic semiconductor chip is arranged at a bottom of the cavity,   an optical lens arranged at the top side of the reflector body, and   an optical waveguide extending through the reflector body from the underside to the top side,   wherein the reflector body is arranged above the second optoelectronic semiconductor chip such that light emitted by the second optoelectronic semiconductor chip passes into the optical waveguide at the underside of the reflector body, and   light may emerge from the optical waveguide at the top side of the reflector body.   
     
     
         2 . The optoelectronic component according to  claim 1 , wherein a deflection element is arranged above the top side of the reflector body such that light emerging from the optical waveguide is deflected into the optical lens. 
     
     
         3 . The optoelectronic component according to  claim 2 , wherein the deflection element comprises a reflective layer arranged at the optical lens. 
     
     
         4 . An optoelectronic component comprising:
 a first optoelectronic semiconductor chip configured to emit light comprising a wavelength from the infrared spectral range;   a second optoelectronic semiconductor chip configured to emit light comprising a wavelength from the visible spectral range; and   a reflector body comprising a top side and an underside,   wherein the reflector body comprises a cavity opened toward the top side,   a wall of the cavity constitutes a reflector,   the first optoelectronic semiconductor chip is arranged at a bottom of the cavity, and   the underside of the reflector body is arranged above a top side of the second optoelectronic semiconductor chip.   
     
     
         5 . The optoelectronic component according to  claim 4 ,
 wherein the underside of the reflector body is arranged above a top side of the second optoelectronic semiconductor chip,   a channel-shaped recess is formed at the underside of the reflector body,   the first perforation extends to the channel-shaped recess, and   the second optoelectronic semiconductor chip is arranged in the channel-shaped recess.   
     
     
         6 . An optoelectronic component comprising:
 a first optoelectronic semiconductor chip configured to emit light comprising a wavelength from the infrared spectral range;   a second optoelectronic semiconductor chip configured to emit light comprising a wavelength from the visible spectral range; and   reflector body comprising a top side and an underside,   wherein the reflector body comprises a cavity opened toward the top side,   a wall of the cavity constitutes a reflector,   the first optoelectronic semiconductor chip is arranged at a bottom of the cavity, and   the second optoelectronic semiconductor chip is arranged at the bottom of the cavity.   
     
     
         7 . The optoelectronic component according to  claim 6 ,
 wherein the second optoelectronic semiconductor chip is arranged at the bottom of the cavity,   the reflector body comprises a second perforation extending between the underside of the reflector body and the cavity, and   the second optoelectronic semiconductor chip is arranged in the second perforation.   
     
     
         8 . The optoelectronic component according to  claim 7 ,
 wherein the cavity comprises a first section widening in a funnel-shaped fashion toward the top side of the reflector body, and a second section widening in a funnel-shaped fashion toward the top side of the reflector body,   the first section and the second section are superimposed on one another, and   the first perforation is arranged at the bottom of the first section of the cavity and the second perforation is arranged at the bottom of the second section of the cavity.   
     
     
         9 . An optoelectronic component comprising:
 a first optoelectronic semiconductor chip configured to emit light comprising a wavelength from the infrared spectral range;   a second optoelectronic semiconductor chip configured to emit light comprising a wavelength from the visible spectral range; and   a reflector body comprising a top side and an underside,   wherein the reflector body comprises a cavity opened toward the top side,   a wall of the cavity constitutes a reflector,   the first optoelectronic semiconductor chip is arranged at a bottom of the cavity, and   the second optoelectronic semiconductor chip is arranged on a top side of the first optoelectronic semiconductor chip.   
     
     
         10 . The optoelectronic component according to  claim 9 , wherein a top side of the second optoelectronic semiconductor chip comprises a smaller size than the top side of the first optoelectronic semiconductor chip. 
     
     
         11 . The optoelectronic component according to  claim 9 , wherein the second optoelectronic semiconductor chip is at least partly transparent to light emitted by the first optoelectronic semiconductor chip. 
     
     
         12 . The optoelectronic component according to  claim 9 ,
 wherein the reflector body comprises, at a bottom of the cavity, a first perforation extending between the underside of the reflector body and the cavity, and   the first optoelectronic semiconductor chip is arranged in the first perforation.   
     
     
         13 . The optoelectronic component according to  claim 9 ,
 wherein the optoelectronic component comprises a carrier,   the reflector body is arranged on the carrier such that the underside of the reflector body faces the carrier, and   the first optoelectronic semiconductor chip is arranged on the carrier.   
     
     
         14 . The optoelectronic component according to  claim 9 , wherein the cavity widens in funnel-shaped fashion toward the top side of the reflector body. 
     
     
         15 . The optoelectronic component according to  claim 9 , wherein the optoelectronic component comprises an optical lens arranged at the top side of the reflector body. 
     
     
         16 . The optoelectronic component according to  claim 15 , wherein the optical lens comprises a conical lens section extending into the cavity of the reflector body. 
     
     
         17 . The optoelectronic component according to  claim 9 , wherein the second optoelectronic semiconductor chip is configured as a volume emitting semiconductor chip. 
     
     
         18 . The optoelectronic component according to  claim 9 , wherein the second optoelectronic semiconductor chip is configured to emit light comprising a wavelength from the red spectral range. 
     
     
         19 . The optoelectronic component according to  claim 9 , wherein the optoelectronic component comprises a third optoelectronic semiconductor chip configured to emit light comprising a wavelength from the visible spectral range. 
     
     
         20 . A method of operating the optoelectronic component according to  claim 9 ,
 wherein the first optoelectronic semiconductor chip is operated in pulsed operation, and   the second optoelectronic semiconductor chip is operated in continuous operation or pulsed operation that is anticyclic with respect to the pulsed operation of the first optoelectronic semiconductor chip.