US2020357869A1PendingUtilityA1

Display apparatus and method of manufacturing the same

57
Assignee: SAMSUNG DISPLAY CO LTDPriority: May 10, 2019Filed: Feb 26, 2020Published: Nov 12, 2020
Est. expiryMay 10, 2039(~12.8 yrs left)· nominal 20-yr term from priority
Inventors:Yunjung ChoiSangyeol KimSokwon NohHaram YooYounghoon JoJungmin Choi
H10K 59/873H10K 71/00H10K 59/122C23C 14/042H01L 27/3272H01L 27/3246H01L 51/56H01L 51/5246H10K 59/1315H10K 59/123H10K 59/126H10K 59/1201H10K 2102/351H10K 59/1213
57
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Claims

Abstract

A display apparatus includes: a substrate that includes a display area, an opening area formed in the display area, and a non-display area that surrounds at least a portion of the opening area; a pixel defining area formed on the substrate and that includes at least one opening; an intermediate layer disposed on the at least one opening; an opposite electrode that covers the intermediate layer and the pixel defining layer; and a capping layer that covers the opposite electrode. An end portion of at least one of the intermediate layer, the opposite electrode, or the capping layer is formed on the pixel defining layer and has a thickness that decreases away from the at least one opening.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A display apparatus, comprising:
 a substrate that includes a display area, an opening area in the display area, and a non-display area that surrounds at least a portion of the opening area;   a pixel defining layer on the substrate and that includes at least one opening;   an intermediate layer disposed in the at least one opening;   an opposite electrode that covers the intermediate layer and the pixel defining layer; and   a capping layer that covers the opposite electrode, wherein   an end portion of at least one of the intermediate layer, the opposite electrode, or the capping layer is disposed on the pixel defining layer and has a thickness that decreases away from the at least one opening.   
     
     
         2 . The display apparatus of  claim 1 , wherein the intermediate layer comprises at least one of a first functional layer or a second functional layer. 
     
     
         3 . The display apparatus of  claim 1 , wherein the intermediate layer, the opposite electrode, and the capping layer are sequentially stacked on the pixel defining layer. 
     
     
         4 . The display apparatus of  claim 1 , further comprising an encapsulation substrate disposed on and spaced above the substrate. 
     
     
         5 . The display apparatus of  claim 1 , further comprising a thin film encapsulation layer disposed on the capping layer. 
     
     
         6 . The display apparatus of  claim 1 , wherein a penetration hole is formed in the opening area. 
     
     
         7 . A method of manufacturing a display apparatus, the method comprising:
 forming a pixel defining layer on a substrate, wherein the substrate includes an opening area and a non-display area that at least partially surrounds the opening area;   forming a shielding unit that covers a portion of the pixel defining layer, the opening area and the non-display area; and   forming an intermediate layer, an opposite electrode, and a capping layer on the pixel defining layer and the shielding unit.   
     
     
         8 . The method of  claim 7 , wherein
 the shielding unit comprises:
 a first shielding unit that shields the opening area; and 
 a second shielding unit connected to the first shielding unit and spaced above an upper surface of the pixel defining layer. 
   
     
     
         9 . The method of  claim 8 , wherein the first shielding unit and the second shielding unit are respectively formed at different heights. 
     
     
         10 . The method of  claim 8 , wherein the shielding unit further comprises an adhesion unit formed under the first shielding unit. 
     
     
         11 . The method of  claim 10 , wherein at least a portion of the adhesion unit is formed in the non-display area. 
     
     
         12 . The method of  claim 7 , further comprising removing the shielding unit from the substrate. 
     
     
         13 . The method of  claim 7 , further comprising forming an encapsulation substrate above and apart from the substrate and attaching the encapsulation substrate to the substrate. 
     
     
         14 . The method of  claim 7 , further comprising forming a thin film encapsulation layer on the pixel defining layer. 
     
     
         15 . The method of  claim 7 , further comprising forming a penetration hole in the substrate. 
     
     
         16 . A method of manufacturing a display apparatus, the method comprising:
 forming a pixel defining layer on a substrate, wherein the substrate includes an display area, opening area in the display area and a non-display area that at least partially surrounds the opening area; and   attaching a shielding unit to the opening area or non-display area that shields a portion of the pixel defining layer, the opening area and the non-display area,   wherein a portion of the shielding unit is spaced apart from the pixel defining layer, and   wherein a first portion of the shielding unit is formed at a height that differs from a height of a second portion of the shielding unit.   
     
     
         17 . The method of  claim 16 , further comprising:
 forming an intermediate layer, an opposite electrode, and a capping layer on the pixel defining layer and the shielding unit.   
     
     
         18 . The method of  claim 16 , wherein the shielding unit is attached to the display area or the non-display area. 
     
     
         19 . The method of  claim 16 , wherein
 the shielding unit is attached to the display area or the non-display area at a plurality of positions in the display area or the non-display area, wherein the plurality of positions are spaced apart from each other.   
     
     
         20 . The method of  claim 16 , wherein the shielding unit attached to the non-display area and covers the opening area. 
     
     
         21 . The method of  claim 16 , further comprising removing the shielding unit from the substrate. 
     
     
         22 . The method of  claim 16 , further comprising forming an encapsulation substrate over the substrate that is spaced apart from the substrate and combining the encapsulation substrate with the substrate. 
     
     
         23 . The method of  claim 16 , further comprising forming a thin film encapsulation layer on the pixel defining layer. 
     
     
         24 . The method of  claim 16 , further comprising fora in g a penetration hole in the substrate.

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