Vapor chamber

Abstract

A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

What is claimed is: 
     
         1 . A vapor chamber, comprising:
 an upper plate; and   a lower plate attached on the upper plate, wherein the upper plate and the lower plate are combined together to define a working space, and the lower plate is in thermal contact with a heat source,   wherein a reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.   
     
     
         2 . The vapor chamber according to  claim 1 , wherein a metallic strength of the reinforcing layer is superior to a metallic strength of the upper plate or the lower plate, but a thermal conduction property of the reinforcing layer is inferior to a thermal conduction property of the upper plate or the lower plate. 
     
     
         3 . The vapor chamber according to  claim 2 , wherein the metallic strength is measured according to a Vickers hardness, a tensile strength or an elasticity coefficient. 
     
     
         4 . The vapor chamber according to  claim 2 , wherein the thermal conductivity is measured according to a thermal conductivity coefficient. 
     
     
         5 . The vapor chamber according to  claim 1 , wherein the reinforcing layer is made of nickel, stainless steel or titanium. 
     
     
         6 . The vapor chamber according to  claim 1 , wherein the reinforcing layer has corrosion resistance. 
     
     
         7 . The vapor chamber according to  claim 1 , wherein a first capillary structure is formed on a surface of the upper plate facing the working space, and a second capillary structure is formed on a surface of the lower plate facing the working space, wherein at least one support structure is arranged between the first capillary structure and the second capillary structure. 
     
     
         8 . The vapor chamber according to  claim 1 , further comprising a heat conduction block, wherein the heat conduction block is arranged between the lower plate and the heat source, and the heat conduction block is made of pure copper. 
     
     
         9 . The vapor chamber according to  claim 1 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate. 
     
     
         10 . The vapor chamber according to  claim 1 , wherein the lower plate comprises a raised structure, and the raised structure is in thermal contact with the heat source. 
     
     
         11 . The vapor chamber according to  claim 10 , wherein the reinforcing layer is formed on the surface of the lower plate away from the working space, and the reinforcing layer is arranged between the raised structure and the heat source. 
     
     
         12 . The vapor chamber according to  claim 10 , wherein the reinforcing layer is formed on the surface of the lower plate away from the working space, the reinforcing layer has an open space corresponding to the raised structure, and the raised structure is exposed to the open space. 
     
     
         13 . The vapor chamber according to  claim 10 , further comprising a heat conduction block, wherein the heat conduction block is arranged between the raised structure and the heat source, and the heat conduction block is made of pure copper. 
     
     
         14 . The vapor chamber according to  claim 1 , further comprising a fixing frame, wherein the fixing frame is attached on the lower plate, and the fixing frame comprises a fastening part. 
     
     
         15 . The vapor chamber according to  claim 14 , wherein the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate. 
     
     
         16 . The vapor chamber according to  claim 14 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate. 
     
     
         17 . The vapor chamber according to  claim 14 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame. 
     
     
         18 . The vapor chamber according to  claim 14 , wherein a metallic strength of the fixing frame is superior to a metallic strength of the lower plate. 
     
     
         19 . The vapor chamber according to  claim 14 , wherein the lower plate is made of pure copper, and the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy. 
     
     
         20 . The vapor chamber according to  claim 14 , further comprising a heat conduction block, wherein the heat conduction block is arranged between the fixing frame and the heat source, and the heat conduction block is made of pure copper. 
     
     
         21 . The vapor chamber according to  claim 1 , further comprising a fixing frame, wherein the fixing frame comprises a fastening part, the reinforcing layer is formed on the surface of the lower plate away from the working space, and the fixing frame is attached on the reinforcing layer. 
     
     
         22 . The vapor chamber according to  claim 21 , wherein the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate. 
     
     
         23 . The vapor chamber according to  claim 21 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate. 
     
     
         24 . The vapor chamber according to  claim 21 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame. 
     
     
         25 . The vapor chamber according to  claim 21 , wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the reinforcing layer. 
     
     
         26 . The vapor chamber according to  claim 21 , wherein a metallic strength of the fixing frame or the reinforcing layer is superior to a metallic strength of the lower plate. 
     
     
         27 . The vapor chamber according to  claim 21 , wherein the lower plate is made of pure copper, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy, and the reinforcing layer is made of nickel, stainless steel or titanium. 
     
     
         28 . The vapor chamber according to  claim 21 , further comprising a heat conduction block, wherein the heat conduction block is arranged between the fixing frame and the heat source, and the heat conduction block is made of pure copper.