Systems and devices for quality monitoring of additive manufacturing processes
Abstract
A system for use in characterizing parts made by additive manufacturing processes, comprising a sensing device having an upper surface and a lower surface; at least one channel formed in the upper surface of the sensing device, wherein the at least one channel is formed to a predetermined depth in the upper surface of the sensing device, and wherein the at least one channel is formed in a predetermined pattern across the upper surface of the sensing device; and a sensor disposed within each channel formed in the upper surface of the sensing device, wherein each sensor is operative to gather information relevant to an additive manufacturing process occurring on or in close proximity to the sensing device.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A system for use in characterizing parts made by additive manufacturing processes, comprising:
(a) a sensing device having an upper surface and a lower surface; (b) at least one channel formed in the upper surface of the sensing device,
(i) wherein the at least one channel is formed to a predetermined depth in the upper surface of the sensing device, and
(ii) wherein the at least one channel is formed in a predetermined pattern across the upper surface of the sensing device; and
(c) a sensor disposed within each channel formed in the upper surface of the sensing device, wherein each sensor is operative to gather information relevant to an additive manufacturing process occurring on or in close proximity to the sensing device.
2 . The system of claim 1 , further comprising a computer or data processor connected to or in electrical communication with each sensor, wherein the computer or data processor further includes software for analyzing data collected by the sensor or plurality of sensors.
3 . The system of claim 1 , further comprising a cover having a predetermined thickness, wherein the cover encloses each sensor disposed within a channel formed in the upper surface of the sensing device.
4 . The system of claim 3 , wherein the cover is adapted to be used as a substrate for additive manufacturing processes.
5 . The system of claim 3 , wherein the cover is formed by depositing successive layers of metal on the upper surface of the sensing device.
6 . The system of claim 5 , wherein the successive layers of metal are deposited using an ultrasonic additive manufacturing process. The system of claim 1 , wherein the sensing device is aluminum, stainless steel, nickel alloy, or combinations thereof.
8 . The system of claim 1 , wherein the sensor is an optical sensor. The system of claim 1 , wherein the sensor is a thermocouple; a strain gauge; a microphone; an accelerometer; an ultrasonic non-destructive evaluation sensor; or a magnetic sensor.
10 . A system for use in characterizing parts made by additive manufacturing processes, comprising:
(a) a sensing device having an upper surface and a lower surface; (b) a plurality of channels formed in the upper surface of the sensing device,
(i) wherein each channel is formed to a predetermined depth in the upper surface of the sensing device,
(ii) wherein each channel is formed in a predetermined pattern across the upper surface of the sensing device, and
(iii) wherein the predetermined patterns of the channels are formed in the same orientation relative to one another or in different orientations relative to one another; and
(c) a sensor disposed within each channel formed in the upper surface of the sensing device, wherein each sensor is operative to gather information relevant to an additive manufacturing process occurring on or in close proximity to the sensing device.
11 . The system of claim 10 , further comprising a computer or data processor connected to or in electrical communication with each sensor, wherein the computer or data processor further includes software for analyzing data collected by the sensor or plurality of sensors.
12 . The system of claim 10 , further comprising a cover having a predetermined thickness, wherein the cover encloses each sensor disposed within a channel formed in the upper surface of the sensing device.
13 . The system of claim 12 , wherein the cover is formed by depositing successive layers of metal on the upper surface of the sensing device, and wherein the cover is adapted to be used as a substrate for additive manufacturing processes.
14 . The system of claim 13 , wherein the successive layers of metal are deposited using an ultrasonic additive manufacturing process.
15 . The system of claim 10 , wherein the sensing device is aluminum, stainless steel, nickel alloy, or combinations thereof.
16 . The system of claim 11 , wherein the sensors are optical sensors, thermocouples; strain gauges; microphones; accelerometers; ultrasonic non-destructive evaluation sensors;
magnetic sensors; or combinations thereof.
17 . A system for use in characterizing parts made by additive manufacturing processes, comprising:
(a) a sensing device having an upper surface and a lower surface; (b) a plurality of channels formed in the upper surface of the sensing device,
(i) wherein each channel is formed to a predetermined depth in the upper surface of the sensing device,
(ii) wherein each channel is formed in a predetermined pattern across the upper surface of the sensing device, and
(iii) wherein the predetermined patterns of the channels are formed in the same orientation relative to one another or in different orientations relative to one another;
(c) a sensor disposed within each channel formed in the upper surface of the sensing device, wherein each sensor is operative to gather information relevant to an additive manufacturing process occurring on or in close proximity to the sensing device; and (d) at least one additional sensor not within the sensing device for further analyzing parts made by additive manufacturing.
18 . The system of claim 17 , further comprising a computer or data processor connected to or in electrical communication with each sensor, wherein the computer or data processor further includes software for analyzing data collected by the sensor or plurality of sensors.
19 . The system of claim 10 , further comprising a cover having a predetermined thickness, wherein the cover encloses each sensor disposed within a channel formed in the upper surface of the sensing device.
20 . The system of claim 11 , wherein the sensors in the sensor plate are optical sensors, thermocouples; strain gauges; microphones; accelerometers; ultrasonic non-destructive evaluation sensors; magnetic sensors; or combinations thereof; and wherein the additional sensors are thermal cameras; optical cameras; three-dimensional laser scanners; or combinations thereof.Join the waitlist — get patent alerts
Track US2020346405A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.